Non Conductive Adhesives

Thermally and chemically resistant

Non Conductive Adhesives

Non conductive adhesives can withstand high thermal loads and can potentially provide high shock and peel resistance. They demonstrate excellent chemical resistance, thermal shock and impact resistance while also maintaining a wide operating temperature range.

Our range of Non conductive adhesives (NCA) can achieve great bonding to a variety of substrates while also being thermally and chemically resistant.These Henkel adhesives are designed for us in temperature sensitive electronics such as CMOS image sensors and in high throughput assembly that requires low temperature cure. With an operating temperature range between -40ºC to 130ºC they are ideal for substrate attachment and can be used for lens holder, lens barrel and IR filter bonding.

NCA dual cure adhesives provide improved adhesion to LCP and aluminium for automotive applications and they can be used for automatic dispensing, screen printing and led applications. Their flexibility derives from the fact that they can be dual cured but can also be used either as a single component or two component epoxies with a resin and a catalyst.

Product selector guide

Non Conductive Adhesives
Product	Specific Gravity	Hardness	Viscosity (mPA*s)	Glass transition temperature (°C)	CTE a1	CTE a2	Recommended cure	Attributes
LINQBOND NCA-3120	-	80	22,000	30	70	190	Ramp to 180°C and hold for 10 minutes	Camera module assembly, LED light lens bonding, electronic components, etc.
LINQBOND SMA3601	1.35	86	≥550,000	125	64	215	-	Surface mount technology (SMT) applications, demanding electronic device encapsulation, and chip bonding
LINQBOND SMA3602	1.35	86	70,000 –120,000	125	64	215	3min @120°C	Surface mount technology (SMT) applications, demanding electronic device encapsulation, and chip bonding
LINQBOND SMA3603	1.35	87	150,000	98	55	206	150s @120°C	SMT (Surface-Mount Technology) applications, electronic device encapsulation, and chip bonding
LINQBOND SMA3611	1.36	89	450,000 –750,000	121	54	160	120s @130°C	SMT (Surface-Mount Technology) applications, electronic device encapsulation, and chip bonding
Loctite 3128	1.6	88	27,000	45	40	130	60min @60°C	Memory cards, CCD/CMOS Assemblies and Lid/Cap attach for optical sensors and 3d sensing modules.
Loctite 3217	1.2	86	109,000	82	53	178	30min @60°C	Optical applications and the cavity fill of test ICs.
Loctite 3296	1.8	94	33,700	189	22.1	-	30 min @120℃	ADAS Optical Modules
Loctite 3616	1.33	-	25,000	140	86	-	90sec @150°C	Bonding of surface mounted devices to printed circuit boards prior to wave soldering.
Loctite 3621	1.22	-	3,000	110	100	218	30min @150°C	Chipbonder. Suited for applications with very high dispense speeds and high dot profile.
Loctite 3703	1.12	-	20,000	-	-	-	10sec @6 mW/cm2	PVC to polycarbonate for large gap filling (0.25mm) and a flexible joint.
Loctite 968-4	-	-	120,000	167	30	98	2 hours @ 150°C	High-performance, heat-cure epoxy adhesive formulated for hybrid component attachment
Loctite AA 3106	1.08	53	5,000	-	-	-	15sec @6 mW/cm2	Excellent adhesion to glass, many plastics and most metals.
Loctite AA 3526	1.06	62	17,500	36	-	-	5sec @6 mW/cm2	UV/visible light-cured, liquid modified acrylic adhesive.
Loctite Ablestik 2332	1.17	75	70,000	105	100	-	60min @120°C	Universal adhesive that can be used, among others, for SMD components, caps and lids.
Loctite Ablestik G500	-	86	-	-	-	-	60min @125°C	General purpose epoxy adhesive and sealant that cures to a high gloss finish.
Loctite Ablestik NCA 2280	1.3	90	54,000	90	45	156	30 minutes @ 80°C	Dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components.
Loctite Ablestik NCA 2286	-	85	40,000	28	55	165	4sec @220nm	Use in active alignment applications in camera module assembly.
Loctite Ablestik NCA 2390	1.2	87	62,000	94	68	170	30 minutes @ 80°C	Dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components.
Loctite Ablestik TE3530	-	-	60,000	-	36	-	30min at 100°C	Bonding heat dissipation components and applied by automatic syringe dispense (2.3 W/mK)
Loctite D125F	1.275	80	1,750,000	85	58	-	20 min @ 100 °C	Heat-curable epoxy for high-speed dispensing in surface mount technology (SMT) assembly
Loctite DSP 190024	1.12	-	20,000	-	-	-	10sec at 365nm	UV curable sealant for displays. Cured by exposure to UV and/or visible light
Loctite Eccobond 3707	-	-	9,595	53	52	151	30sec @100 mW/cm2	UV + Heat Curable edgebond designed for bonding electronic components on a PCB.
Loctite HHD 3607BK	-	75	6,500	-	-	-	Moisture	Moisture curable reactive polyurethane for glass surfaces
Loctite SF 7360	-	-	-	-	-	-	-	Cleaner for uncured adhesive and adhesive residues found following PCB assembly. Fully compatible with epoxy adhesives

*UV Cure Values are indicative of the fixture step. Check the TDS for more information.

Frequently asked questions

Why would I want to Dual cure my product?

Dual cure products are formulated to temporarily cure when exposed to UV light, followed with a secondary thermal cure at low temperature. Temporarily curing the material allows for any necessary adjustments to the final device configuration.

What are the benefits of two component adhesives?

Two-component non conductive adhesives require no refrigeration or freezer storage and include products that provide high peel and tensile lap shear strength over a broad temperature range. Two component epoxies are not premixed so they eliminate pot life issues making them easier to use, transfer, store and preserve.

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Adhesives for CMOS & 3D Image sensors

Key requirements for adhesives that can be used in sensor bonding are:

Adhesion to variety of substrates (PC, LCP, etc.)
Low temperature cure - below 100°C
Fast cure - below 60mins
Operating temperature range -40ºC to 130ºC
Low halogen content

We offer a wide range of adhesives that are suitable as Lens Holder, Lens Barrel and IR Filter bonding. Depending on the process there are adhesives that are stencil printable or dispensable, UV, Heat or Dual cure and with a high range of viscosity and thixotropy ratings.

The usual process for such bonding starts with dispensing the adhesive and then positioning and aligning the component. Next steps usually consist of fixating the component with light cure that is then finalized with Heat curing.Hence the need for dual curing. It is not necessary but it is process dependent and can help with the precision alignment steps.

CMOS sensor bonding process

cmos sensor bonding process