LOCTITE ABLESTIK 2112

Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm

LOCTITE ABLESTIK 2112

Main features

  • Critical Electronics/Aerospace Bonding
  • Non-Sag PCB Component Staking
  • Electrical Insulation and Environmental Resistance

Product Description

LOCTITE ABLESTIK 2112 BIPAX is a two-component, thixotropic, non-conductive epoxy adhesive supplied as a milky, translucent resin and hardener at a 100:22 mix ratio in a BIPAX mixing-dispenser package. This solvent-free system cures at room temperature over 24 hours or faster at 65°C, and supports continuous service from -60°C to 125°C. It is recommended for critical electronic, aerospace, and industrial bonding, laminating, and reinforcing applications, including staking components to printed circuit boards for enhanced mechanical rigidity. The non-sag rheology supports precise application, and the cured adhesive offers good chemical resistance, good electrical insulation, and environmental resistance across metals, glass, ceramics, wood, and plastics.

Key features

  • Non-sag, thixotropic rheology: Supports precise application and PCB component staking without slumping.
  • Good electrical insulation: Non-conductive with a dielectric strength of 410 volts/mil.
  • Electronics and aerospace grade: Recommended for critical electronic, aerospace, and industrial bonding applications.

Applications / Suitable for: Critical electronic, aerospace, and industrial bonding, laminating, and reinforcing, including staking components to printed circuit boards.

Product Family

ABLESTIK 2112

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Milky
Specific GravitySpecific Gravity
1.22
Physical Properties
ViscosityViscosity
60000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
93 °C
Operating TemperatureOperating Temperature
-60 to 125 °C
Electrical Properties
Volume ResistivityVolume Resistivity
60000000000000 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the uncured, mixed material prior to cure.

Property Value Unit Method / condition
Mix ratio (Resin : Hardener) 100 : 22 by weight
Viscosity, mixed 60,000 mPa·s (cP) Brookfield RV #7, 10 rpm
Thixotropic index 6.5 1/10 rpm ratio
Specific gravity, mixed 1.2 Mixed material
Pot life 30 minutes @ 25°C, mixed
Technical properties

As-supplied / before-processing properties

Typical properties of the uncured, mixed material prior to cure.

Property Value Unit Method / condition
Mix ratio (Resin : Hardener) 100 : 22 by weight
Viscosity, mixed 60,000 mPa·s (cP) Brookfield RV #7, 10 rpm
Thixotropic index 6.5 1/10 rpm ratio
Specific gravity, mixed 1.2 Mixed material
Pot life 30 minutes @ 25°C, mixed

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