LOCTITE ABLESTIK 2101
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- 23 N/mm^2 Aluminum Lap Shear
- High-Resistivity Electrical Insulation
- Fuel, Oil, and Acid Resistance
Product Description
LOCTITE ABLESTIK 2101 BIPAX is a two-component, non-conductive epoxy adhesive supplied as a clear to slightly hazy liquid at a 100:25 resin-to-hardener mix ratio. Packaged in a convenient BIPAX mixing-dispenser for easy mixing, it cures at room temperature over 24 hours or faster with a heat cure of 4 hours at 65°C, and is suitable for continuous service from -60°C to 135°C. The adhesive bonds metals, ceramics, glass, wood, leather, and many rigid plastics, and is well suited to laminating, bonding, and repair applications requiring structural, mechanical, and electrical performance. Cured material offers strong electrical insulation and broad chemical resistance, including to petroleum solvents, fuels, and mild acids and alkalis.
Key features
- High lap shear strength: 23 N/mm² (3,300 psi) on aluminum-to-aluminum bonds.
- Good electrical insulator: Volume resistivity of 6×10¹⁵ ohm-cm at 25°C.
- Easy mixing: Supplied in a BIPAX package for convenient, uniform two-component mixing.
Applications / Suitable for: Laminating, bonding, and repair of metals, ceramics, glass, wood, leather, and rigid plastics where structural, mechanical, and electrical insulating performance are required.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of the uncured, mixed material prior to cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio (Resin : Hardener) | 100 : 25 | by weight | — |
| Viscosity, mixed | 19,000 | mPa·s (cP) | @ 25°C |
| Specific gravity, mixed | 1.2 | — | Mixed material |
| Pot life | 30 | minutes | @ 25°C, mixed |
After-processing / final-state properties
Typical properties of the fully cured material after the recommended cure schedule.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass transition temperature (Tg) | 62.0 | °C | Cured material |
| Volume resistivity | 6×10¹⁵ | ohm·cm | @ 25°C |
| Dielectric strength | 370 | volts/mil | Cured material |
| Coefficient of linear thermal expansion | 55 | ppm/°C | Cured material |
| Lap shear strength, Al to Al | 23 (3,300) |
