ABLESTIK 2332-17U

Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm

ABLESTIK 2332-17U

Main features

  • Solvent-Free Bonding Formulation
  • 90-Minute 100 deg C Cure
  • 24 N/mm^2 Aluminum Lap Shear

Product Description

LOCTITE® ABLESTIK 2332-17U is a one-component, solvent-free epoxy adhesive developed for assembly bonding across copper, aluminum, nickel, fiber-reinforced plastic, rigid plastics, and oily steel. The black, slightly thixotropic material provides a typical viscosity of 100,000 mPa·s at 25°C and is formulated to develop high bond strength with heat cure at temperatures from 100°C. Guideline cure options include 90 minutes at 100°C, 30 minutes or 1 hour at 120°C, and 20 minutes at 150°C. Typical cured performance includes a minimum Shore D hardness of 75 and aluminum-to-aluminum tensile lap shear strength of 24 N/mm² at 25°C.

Key features

  • Broad substrate capability: Documented for bonding copper, aluminum, nickel, fiber-reinforced plastic, rigid plastics, and oily steel.
  • One-component, solvent-free formulation: Eliminates component mixing while providing slightly thixotropic handling.
  • Low-temperature heat cure: Guideline cure schedules begin at 90 minutes at 100°C, with faster options at higher temperatures.

Applications / Suitable for

  • General assembly bonding
  • Bonding copper, aluminum, and nickel
  • Bonding fiber-reinforced plastic and rigid plastics
  • Bonding oily steel under validated application conditions
Product Family

ABLESTIK 2332-17U

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Black
Chemistry TypeChemistry Type
Epoxy
Specific GravitySpecific Gravity
1.16
Physical Properties
ViscosityViscosity
100000 mPa.s

Additional Information

Technical properties

As-supplied / before-processing properties

Typical physical, storage, and guideline cure information for the adhesive before final processing.

Property Value Unit Method / condition
Technology Epoxy One-component, solvent-free, heat-cured adhesive
Appearance Black liquid TDS describes the material as slightly thixotropic; SDS physical-state description is liquid
Viscosity 100,000 mPa·s (cP) At 25°C; test method not stated
Specific gravity 1.16 At 25°C; SDS reports density/relative density of 1.2
Shelf life 213 days At 0 to 4°C
Recommended cure schedule 1 hour At 120°C; guideline recommendation
Alternative cure schedules 90 minutes, 30 minutes, or 20 minutes 90 minutes at 100°C, 30 minutes at 120°C, or 20 minutes at 150°C; guideline recommendations
Optimal storage 0 to 4 °C Store unopened in a dry location
Technical properties

After-processing / final-state properties

Typical cured hardness and bonded-joint performance. Values are reference data and are not product specifications.

Property Value Unit Method / condition
Hardness ≥75 Shore D At 25°C; cure condition and test method not stated
Tensile lap shear strength — aluminum to aluminum 24 (3,500) N/mm² (psi) Tested at 25°C; surface preparation, bondline, cure condition, and test method not stated

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