ABLESTIK 286

Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm

ABLESTIK 286

Main features

  • 1.04 W/(m K) Thermal Interface
  • 30-Minute Working Window
  • Room-Temperature Thermal Interface Cure

Product Description

LOCTITE® ABLESTIK 286 is a two-component, thermally conductive and electrically insulating epoxy adhesive for assembly applications. The white, thixotropic system is formulated to provide minimal flow while maintaining substrate wetting and is documented for bonding most metals and most plastics. Part A and Part B mix at 100:100 by volume or 100:180 by weight. The mixed adhesive provides a typical 30-minute work life for a 100 g mass at 25°C and can cure for 24 hours at 25°C or more rapidly with heat. Typical cured properties include thermal conductivity of 1.04 W/(m·K), volume resistivity of 1 × 1015 ohm-cm, and an operating-temperature range of -55 to 105°C.

Key features

  • Thermally conductive and electrically insulating: Typical cured thermal conductivity is 1.04 W/(m·K), with volume resistivity of 1 × 1015 ohm-cm at 25°C.
  • Thixotropic flow control: Formulated to minimize flow without sacrificing wetting during assembly and piping applications.
  • Room-temperature or accelerated cure: Guideline schedules include 24 hours at 25°C, 4 hours at 45°C, or 2 hours at 65°C.

Applications / Suitable for

  • General assembly bonding
  • Piping applications
  • Maintenance and production requirements
  • Bonding most metals and most plastics
Product Family

ABLESTIK 286

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Work life @25°CWork life @25°C
0.5 hours
Thermal Properties
Operating TemperatureOperating Temperature
-55 to 105 °C
Thermal ConductivityThermal Conductivity
1.04 W/m.K
Electrical Properties
Volume ResistivityVolume Resistivity
1 x 10¹⁵ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical component, mixed, handling, storage, and guideline cure information before final processing.

Property Value Unit Method / condition
Technology — Part A Epoxy Resin component
Technology — Part B Amine Hardener component
Appearance — Part A White paste As supplied
Appearance — Part B White paste As supplied
Mix ratio — Part A:Part B 100:100 by volume Documented mix ratio
Mix ratio — Part A:Part B 100:180 by weight Documented mix ratio
Density — Part A 1.21 g/cm³ ASTM D792
Density — Part B 2.0 g/cm³ ASTM D792
Density — mixed 1.71 g/cm³ ASTM D792
Work life 30 minutes 100 g mass at 25°C
Shelf life 548 days At 25°C
Recommended cure schedule 24 hours At 25°C; guideline recommendation
Alternative cure schedules 4 hours or 2 hours 4 hours at 45°C or 2 hours at 65°C; guideline recommendations
Optimal storage 25 °C Store in original, tightly covered containers in clean, dry areas
Technical properties

After-processing / final-state properties

Typical cured thermal, electrical, and mechanical properties. Values are reference data and are not product specifications.

Property Value Unit Method / condition
Operating-temperature range -55 to 105 °C Documented product range
Coefficient of thermal expansion 36 ppm/°C ASTM D3386
Thermal conductivity 1.04 W/(m·K) ASTM D2214
Volume resistivity 1 × 1015 ohm-cm ASTM D257 at 25°C
Flexural strength 83 (12,000) N/mm² (psi) ASTM D790
Tensile lap shear strength — aluminum to aluminum 15.2 (2,200) N/mm² (psi) ASTM D1002, aluminum to aluminum at 25°C

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