LOCTITE 3614
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- One-Component Heat-Cure Epoxy
- SMD Attachment Applications
- High Wet-Strength Processing
Product Description
LOCTITE® 3614 is a one-component, heat-curing epoxy adhesive specifically designed for attaching surface-mount devices (SMDs) to printed circuit boards (PCBs) before wave soldering operations. The red, high-viscosity adhesive delivers excellent wet strength, high dot profile retention and reliable electrical performance, making it suitable for medium-speed stencil printing processes. Once cured, LOCTITE 3614 provides strong mechanical bonding, high thermal stability and excellent resistance to wave soldering and environmental exposure, ensuring long-term reliability in electronic assembly applications.
Key Features & Benefits
- One-component epoxy adhesive requiring no mixing.
- Designed for SMD attachment prior to wave soldering
- High wet strength and excellent stencil-printing performance.
- Good electrical insulation characteristics after cure.
- Excellent resistance to wave soldering and solder-dip processes.
- High glass transition temperature for thermal durability
- Suitable for automated electronics manufacturing environments
Recommended Applications
- Bonding surface-mount devices (SMDs) to PCBs.
- Wave soldering assembly processes.
- Stencil-print adhesive deposition systems
- Electronic assembly applications requiring strong component retention.
- Small-part bonding and electronic packaging operations.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Epoxy | — | Surface mount adhesive |
| Appearance | Red Viscous Gel | — | Uncured |
| Specific Gravity | 1.36 | — | 25°C |
| Yield Point | 350 - 725 | Pa | 25°C |
| Casson Viscosity | 20 - 65 | Pa·s | 25°C |
| Components | One Component | — | No mixing required |
| Cure Type | Heat Cure | — | Recommended >100°C |
| Wet Strength | Very High | — | Stencil print application |
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) | 155 | °C | Fully cured |
| Coefficient of Thermal Expansion | 52 × 10⁻⁶ | K⁻¹ | ISO 11359-2 |
| Thermal Conductivity | 0.3 | W/m·K | ISO 8302 |
| Volume Resistivity | 1.8 × 10¹⁵ | Ω·cm | IEC 60093 |
| Surface Resistivity | 22 × 10¹⁵ | Ω | IEC 60093 |
| Dielectric Breakdown Strength | 40.1 | kV/mm | IEC 60243-1 |
| Lap Shear Strength (Steel) | ≥25 | N/mm² | ISO 4587, 30 min @ 150°C cure |
| Torque Strength (1206 Capacitor) | 30 - 70 | N·mm | IPC SM817, 5 min @ 125°C cure |
| Wave Solder Resistance | Pass | — | IPC SM817 @ 260°C |
