ABLESTIK 2115
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features
- Shock- and Temperature-Cycling Resistance
- Low-Viscosity Precision Optic Bonding
- 60-Watt Laser-Energy Resistance
Product Description
LOCTITE ABLESTIK 2115 BIPAX is a two-component, clear epoxy adhesive formulated for bonding optical components where alignment accuracy is essential. Supplied at a 100:30 resin-to-hardener mix ratio in a BIPAX mixing-dispenser package, it cures at room temperature over 24 hours or faster with an alternative 1-to-2-hour cure at 65°C, and supports continuous service from -70°C to 100°C. The adhesive is used in laser fabrication and other optic applications, is capable of withstanding 30 seconds of 60-watt direct laser energy, and has been used in cycling applications down to 4 K. Cured bonds offer resistance to water, weathering, ozone, most petroleum solvents, mild acids and alkalis, and other chemicals, bonding glass, rigid plastics, ceramic, and metals.
Key features
- Low viscosity, low shrinkage: 250 cP mixed viscosity supports precise, controlled application in optical assembly.
- Excellent mechanical shock and temperature cycling resistance: Maintains bond integrity through thermal cycling, including cryogenic use down to 4 K.
- High shear strength: 3,800 psi lap shear strength on aluminum-to-aluminum bonds.
Applications / Suitable for: Laser fabrication and other optic applications requiring precise alignment, including cryogenic and thermal cycling environments.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Additional Information
LOCTITE ABLESTIK 2115 BIPAX
LOCTITE ABLESTIK 2115 BIPAX is a two-component, clear epoxy adhesive for precision bonding of optical components where alignment accuracy is important. It combines low viscosity and low shrinkage with mechanical shock and temperature-cycling resistance, bonds glass, rigid plastics, ceramic, and metals, and is supplied in BIPAX packaging for controlled mixing.
Typical pre-cure properties
Values below describe the mix ratio or mixed adhesive before cure. Mixed-material values are kept distinct from the separate resin and hardener component states. Values are typical.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio, resin : hardener | 100 : 30 | by weight | Mixing ratio |
| Viscosity, mixed | 250 | cP | At 25 deg C, after mixing |
| Thixotropic index | 1.0 | - | Mixed material |
| Specific gravity, mixed | 1.22 | - | Mixed material |
Mixing, application and cure
LOCTITE ABLESTIK 2115 BIPAX is supplied in a mixing-dispenser package. Surface preparation, thorough component mixing, the available working period after mixing, maintaining contact between the bonded surfaces, and selection of the room-temperature or elevated-temperature cure schedule are the principal processing considerations.
Store the product in its unopened container in a dry location at an optimal storage temperature of 27 deg C. If ingredients crystallize during low-temperature storage, warm the material gently at 52 deg C for 30 minutes before mixing. Material removed from the original container should not be returned after use because it may become contaminated.
Typical cured properties
Values describe the cured adhesive and are typical. Where a specific test method is not available in the supplied information, the method is identified as not stated rather than inferred.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 78 | Shore D | Cured material; method not stated |
| Glass transition temperature (Tg) | 55 | deg C | Cured material; method not stated |
| Coefficient of thermal expansion | 5.50x10^-5 | cm/cm/deg C | Cured material; method not stated |
| Refractive index | 1.55 | - | Cured material; method not stated |
| Izod impact strength | 0.22 | ft-lb/in. of notch | Cured material; method not stated |
| Volume resistivity | 9.00x10^8 | ohm cm | At 25 deg C; method not stated |
| Dielectric strength | 430 | volts/mil | Cured material; method not stated |
| Lap shear strength, Al to Al | 3,800 | psi | Aluminum-to-aluminum bond; method not stated |
Optical bonding applications
Documented use contexts include laser fabrication, precision optical component bonding, and optical assemblies exposed to substantial temperature cycling.
Evaluate LOCTITE ABLESTIK 2115 BIPAX for your optical bonding process
Krayden can help review whether LOCTITE ABLESTIK 2115 BIPAX fits your optical bonding process, including substrate combination, alignment requirements, mixed-material handling, working time, cure schedule, service-temperature considerations, and the relevance of its cured mechanical and electrical properties to your evaluation.





















