Solder shapes & wires

SnPb, In, BiSn and lead-free Solder materials

Solder Elements

Solder shapes, including solder preforms, solder bars, and solder wires, are crucial components in electronic assembly and circuitry. Solder preforms are precisely shaped pieces of solder material used in surface-mount technology (SMT) processes for soldering electronic components onto printed circuit boards (PCBs). These preforms come in various shapes such as rectangles, squares, discs, and custom geometries tailored to specific applications. Solder bars are elongated forms of solder material typically used in wave soldering or hand soldering processes. They are melted to create solder joints between electronic components and PCBs.

Solder wires, on the other hand, are cylindrical strands of solder alloy encased in a flux core. They are widely used in manual soldering operations for their ease of use and precise application. Solder wires are available in different diameters to suit various soldering requirements, ranging from delicate microelectronics to heavy-duty industrial applications.

The selection of solder alloy plays a critical role in determining the performance and reliability of solder joints. Common solder alloys include Tin (Sn), Lead (Pb), Silver (Ag), Copper (Cu), and various combinations thereof. Lead-free solder alloys, such as Tin-Silver-Copper (SAC), have gained prominence due to environmental regulations and consumer safety concerns.

39 products

  • ALPHA 100

    ALPHA 100

    • Non-Activated Type R Flux
    • IPC J-STD-004 ROL0 Classification
    • Extended 1,080-Day Shelf Life
  • ALPHA 3355-HB

    ALPHA 3355-HB

    • Broad Conveyor Preheat Window
    • Multi-Method Flux Application
    • Defined Hot-Water Cleaning Process
  • ALPHA 611F

    ALPHA 611F

    • Low-Pressure Fine-Foam Control
    • Stable Continuous-Aeration Performance
    • Defined Daily Flux Maintenance
  • ALPHA 615-25

    ALPHA 615-25

    • Lower-Solids Surface-Mount Selection
    • Flexible Foam-or-Spray Processing
    • Defined Flux-Control Window
  • ALPHA EF-12000

    ALPHA EF-12000

    • High-Solids Residue for No-Clean Processing
    • Spray Foam or Wave Process Flexibility
    • Bridging-Resistant Hole-Fill Performance
  • ALPHA EF-2210

    ALPHA EF-2210

    • Low-Solids Residue for Legacy Processing
    • OSP Wave and Selective Soldering
    • Defined EF-2100 Replacement Path
  • ALPHA EF-6100-R

    ALPHA EF-6100-R

    • Low-solids, alcohol-based no-clean rework flux supporting both lead-free and tin-lead soldering with fast wetting and a wide thermal process window.
    • Very low levels of non-tacky residue help minimize interference with pin testing while supporting no-clean processing.
    • ORL0 classification backed by documented IPC J-STD-004A/J-STD-004B SIR, Bellcore SIR, electromigration, and corrosion test results.
  • ALPHA EF-6100P

    ALPHA EF-6100P

    • Broad Lead-Free Process Window
    • Reduced Bridging and Solder Balls
    • Low-Residue Pin-Test Surface
  • ALPHA EF-8000

    ALPHA EF-8000

    • Greater Than 96% Hole Fill
    • Low-Bridging Connector Soldering
    • Spray or Foam Application
  • ALPHA EF2202

    ALPHA EF2202

    • VOC-Free No-Clean Legacy Process Reference
    • Historical Wave-Solder Process Fit
    • Direct EF-2100 Replacement Path
  • ALPHA EF6100

    ALPHA EF6100

    • Alloy-Specific Wave Process Control
    • Low-Solids Pin-Testable Residue
    • High-Reliability No-Clean Soldering
  • ALPHA HT-130DM

    ALPHA HT-130DM

    • Non-Sag High-Speed Dispensing
    • Fast 80-Second Heat Cure
    • High-Resistance Electrical Insulation
  • ALPHA SACX Plus 0307

    ALPHA SACX Plus 0307

    • Low dross formation
    • Excellent mechanical reliability
    • Made with Vaculoy technology
  • ALPHA SACX0307

    ALPHA SACX0307

    • 217 to 228 deg C Melting Range
    • Low-Dross Vaculoy Processing
    • Bar, Ingot, or Wire Supply
  • ALPHA SACX0807

    ALPHA SACX0807

    • Low-silver lead-free solder alloy designed to provide soldering and reliability performance similar to higher-silver ALPHA SAC alloys while reducing material cost versus SAC305.
    • Low dross rate, low copper erosion rate, and low surface tension support alloy utilization, fast wetting, high wetting force, and excellent hole fill.
    • Suitable for lead-free wave and selective soldering across single- and double-sided boards, including assemblies with OSP pad finishes exposed to prior reflow excursions.
  • ALPHA SM42-120P

    ALPHA SM42-120P

    • One-component, fast-curing epoxy surface mount adhesive designed for both screen printing and dispensing.
    • Non-sagging formulation with documented excellent adhesion, thermal resistance, and workability.
    • Cured material provides a Tg of 110 +/- 10 °C and insulation resistance greater than 1 x 10^12 ohms after 96 hours at 85 °C/85% RH.
  • ALPHA SM42-1311

    ALPHA SM42-1311

    • High-Speed Room-Temperature Dispensing
    • 80-Second Cure at 150 deg C
    • Non-Sagging Epoxy Paste
  • ALPHA Vaculoy SAC305 Solder Bar

    ALPHA Vaculoy SAC305 Solder Bar

    • Fast wetting
    • Excellent solderability
    • Very good drainage
  • ALPHA WS362

    ALPHA WS362

    • High-activity, 25% solids water-soluble flux designed for densely packed assemblies and multilayer boards requiring relatively high preheat temperatures.
    • Highly water-soluble post-solder residues support effective cleaning for high ionic cleanliness and surface insulation resistance.
    • Halide-free formulation with rapid wetting and support for foam, spray, or wave application techniques.
  • ALPHA WS600

    ALPHA WS600

    • Three Application-Specific Viscosity Options
    • Eight-Hour Stencil Life
    • Water-Soluble Halide-Free Chemistry
  • Hi-Flo Solder Bar Sn63Pb37

    Hi-Flo Solder Bar Sn63Pb37

    • Reduced Wave-Soldering Bridging and Icicling
    • Vaculoy Ultra-High-Purity Manufacturing
    • Conventional or Inert-Atmosphere Wave Soldering
  • INDIUM 10.8HF

    INDIUM 10.8HF

    • Broad Air-Reflow Process Window
    • Low-Voiding QFN and BGA
    • Halogen-Free ROL0 Flux System
  • INDIUM 8.9

    INDIUM 8.9

    • Small-Aperture Transfer Efficiency
    • High Oxidation Resistance
    • Head-in-Pillow Process Control
  • INDIUM 8.9E

    INDIUM 8.9E

    • Fine-Aperture Print Transfer
    • Graping-Resistant Small Deposits
    • Low-Voiding BGA and CSP Reflow
  • INDIUM 8.9HF

    INDIUM 8.9HF

    • Stable Small-Aperture Printing
    • Clear Probe-Testable Residue
    • Low-Voiding High-Temperature Reflow
  • INDIUM 8.9HF1

    INDIUM 8.9HF1

    • 0.4 mm CSP Print Transfer
    • Oxidation-Barrier Defect Control
    • Highly Probe-Testable Residue
  • INDIUM 804120

    INDIUM 804120

    • Wide Printing Process Window
    • Low-Voiding Water-Soluble Flux
    • SAC305 Type 4 Configuration
  • INDIUM NC-SMQ92H

    INDIUM NC-SMQ92H

    • Consistent Fine-Pitch Deposition
    • Extended Stencil and Tack Life
    • Low-Spatter Halogen-Free Reflow
  • Indium SAC305 Solder Bar

    Indium SAC305 Solder Bar

    • Lead-Free SAC305 Bar Solder
    • Lot-Specific Alloy Composition Certification
    • ASTM B32 and J-STD-006 Compliance
  • INDIUM SMQ92J

    INDIUM SMQ92J

    • High-Speed Fine-Pitch Printing
    • Long Stencil and Tack Life
    • Probe-Testable No-Clean Residue
  • KESTER 1429

    KESTER 1429

    • VOC-Free Water-Based Fluxing
    • Self-Neutralizing Post-Solder Residue
    • Water-Only Residue Removal
  • KESTER 1544

    KESTER 1544

    • Activated Rosin Oxide Removal
    • Fast Wetting and Capillary Flow
    • Non-Conductive Post-Solder Residue
  • KESTER 186-18

    KESTER 186-18

    • High-Preheat Thermal Stability
    • RMA-Style Flux Activity
    • Low-Corrosion No-Clean Residue
  • Kester K100LD Lead-Free Solder Wire

    Kester K100LD Lead-Free Solder Wire

    • Eutectic Sn/Cu alloy
    • Controlled metallic dopants
    • Refined grain structure
  • LINQALLOY SW-SAC305 | Solder Wire

    LINQALLOY SW-SAC305 | Solder Wire

    • Leadfree Solder Wire
    • Lowest cost Sn/Ag/Cu Alloy
    • Excellent Fatigue Resistance
  • Pb95.5Sn2.0Ag2.5 | High melting point solder wire

    Pb95.5Sn2.0Ag2.5 | High melting point solder wire

    • 306°C Melting temperature
    • Lead tin silver
    • Ideal for automotive applications
  • SACX Plus 0807

    SACX Plus 0807

    • Low-Silver, Lead-Free Alloy
    • 216 to 225 deg C Solidus-Liquidus Range
    • Vaculoy Oxide-Reduction Processing
  • Sn96.5Ag3.5-PF | Solder Preform

    Sn96.5/Ag3.5-PF | Solder Preform

    • Mid-range temperature alloy for BGA/CSP and die attach components in high power devices
    • High joint strength
    • Highly resistant to thermal fatigue
  • SnCX Plus 07

    SnCX Plus 07

    • Silver-Free Lead-Free Wave-Soldering Alloy
    • Reduced Copper Dissolution at High Temperature
    • Vaculoy Low-Dross Fast-Wetting Processing

Product selector guide

  Alloy Specific gravity Melting Temperature (in °C)
LINQALLOY SW-SAC305 SAC305 7.4 221
LINQALLOY Sn96.5Ag3.5-PF Sn96.5Ag3.5-PF 7.50 221
LINQALLOY Pb95.5Sn2.0Ag2.5 Pb95.5Sn2.0Ag2.5 11.19 306

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