INDIUM 8.9HF | Krayden

Main features

Stable Small-Aperture Printing
Clear Probe-Testable Residue
Low-Voiding High-Temperature Reflow

Product Description

Indium8.9HF Pb-Free Solder Paste is a halogen-free, no-clean solder paste for air reflow in lead-free electronics assembly. The flux system is formulated for stable stencil printing, high transfer efficiency through apertures at or below 0.66 area ratio, and low voiding in BGA, CSP, and QFN joints. It leaves a clear, probe-testable residue and supports long or high-temperature reflow profiles. The paste also wets oxidized BGA and pad surfaces under the stated process conditions. Applications include fine-feature SMT printing and lead-free reflow where the ordered Indium8.9HF alloy and powder configuration is specified.

Key features

Stable Small-Aperture Transfer: High transfer efficiency through apertures at or below 0.66 area ratio supports fine-feature printing.
Clear Probe-Testable Residue: The no-clean residue supports in-circuit probe access after reflow.
Low-Voiding Reflow: The paste is formulated for low voiding in BGA, CSP, and QFN joints.

Applications / Suitable for

Fine-feature SMT stencil printing
BGA, CSP, and QFN assembly
Lead-free air or nitrogen reflow

TDS, SDS & Technical Documents

Indium8.9HF-Pb-Free-Solder-Paste-TDS

English (Technical Data Sheet (TDS))

Technical Specifications

Other Properties

Stencil Life

Up to 60 h hours

Additional Information

Technical properties

As-supplied / before-processing properties

Product-level handling and classification values for Indium8.9HF that do not depend on the unresolved alloy configuration.

Property	Value	Unit	Method / condition
Flux classification	ROL0		IPC J-STD-004B
Chlorine limit	less than 900	ppm	Halogen-free test per EN14582
Bromine limit	less than 900	ppm	Halogen-free test per EN14582
Total halogen limit	less than 1,500	ppm	IEC 61249-2-21; EN14582
Stencil life	up to 12	hours	30 to 60% RH at 22 to 28 deg C
Shelf life	6	months	Unopened container stored below 10 deg C