INDIUM 8.9HF1
Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium
Main features
- 0.4 mm CSP Print Transfer
- Oxidation-Barrier Defect Control
- Highly Probe-Testable Residue
Product Description
Indium8.9HF1 Pb-Free Solder Paste is a halogen-free, no-clean solder paste for air reflow with SAC305 and supported powder configurations. The flux system provides oxidation control for small deposits, supports print transfer on 0.4 mm pitch CSP apertures, and leaves a highly probe-testable residue for in-circuit testing. A typical SAC305 Type 4 viscosity of 1,300 poise and more than 12 hours of stencil life under the stated shop conditions support controlled SMT printing. The paste is used for lead-free assembly in air or nitrogen reflow. Applications include fine-pitch CSP printing, surface-mount assembly, and reflow processes using the stated SAC alloy configurations.
Key features
- 0.4 mm CSP Transfer: Supports print transfer efficiency on 0.4 mm pitch CSP features.
- Oxidation Barrier: Flux chemistry helps suppress graping and head-in-pillow defects.
- Probe-Testable Residue: The no-clean residue supports in-circuit testing after reflow.
Applications / Suitable for
- 0.4 mm pitch CSP printing
- Lead-free surface-mount assembly
- SAC305 air or nitrogen reflow
TDS, SDS & Technical Documents
Technical Specifications
Other Properties
Additional Information
As-supplied / before-processing properties
Typical pre-reflow properties for Indium8.9HF1 with the stated SAC305 powder configuration and handling conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Flux classification | ROL0 | IPC J-STD-004D | |
| Typical viscosity | 1,300 | poise | SAC305 Type 4 powder |
| Metal load | 88.50 | % | SAC305 Type 3 powder |
| Metal load | 88.25 | % | SAC305 Type 4 powder |
| Stencil life | greater than 12 | hours | 30 to 60% RH at 22 to 28 deg C |
| Shelf life | 6 | months | Unopened container stored below 10 deg C |
