ALPHA EF-2210

ALPHA EF-2210 Liquid Soldering Flux has been discontinued. It is a legacy VOC-free, halide-free, rosin/resin-free, 4% solids no-clean flux for wave and selective soldering. The historical process scope includes both tin-lead and lead-free soldering and OSP-coated bare copper boards that have experienced prior thermal excursions. Residues are designed to remain on the board and can be removed with hot water when cleaning is needed. For rotary-drum spray fluxing, DI water is the thinner and the acid number is controlled to 28.5 to 33.5. MacDermid Alpha identifies ALPHA EF-2100 as the direct replacement for EF-2210.

Key features

• VOC-free low-solids chemistry: A 4% solids, halide-free, rosin/resin-free no-clean formulation supports low-residue legacy wave and selective soldering.
• OSP and dual-alloy process fit: Historical guidance covers OSP-coated bare copper boards plus tin-lead and lead-free soldering conditions.
• Direct EF-2100 replacement: MacDermid Alpha identifies ALPHA EF-2100 as the direct replacement for current product selection.

Applications

Historical applications include wave and selective soldering of electronic assemblies, including OSP-coated bare copper boards, under the established EF-2210 process conditions.