ALPHA EF-6100P | Krayden

Main features

Broad Lead-Free Process Window
Reduced Bridging and Solder Balls
Low-Residue Pin-Test Surface

Product Description

ALPHA EF-6100P Liquid Soldering Flux is a low-solids, alcohol-based no-clean flux for wave and selective soldering with lead-free and tin-lead alloys. It is designed for assemblies that require strong through-hole fill, reduced component bridging, and fewer skips. Thermally stable activators support a broad process window, while the formulation resists solder-ball formation across a range of solder masks. Residue is low, non-tacky, and designed to minimize interference with pin testing. Spray application is specified, with separate process ranges for SAC305 or SACX0307 and 63Sn37Pb operation. Typical as-supplied data include 3.8% solids, 0.794 +/- 0.003 specific gravity at 25 deg C, and ORL0 classification.

Key Features

Broad soldering window: Thermally stable activators support lead-free and tin-lead wave soldering.
Reduced solder defects: Designed for strong through-hole fill with reduced bridging, skips, and solder-ball formation.
Pin-testable low residue: Very low, non-tacky residue minimizes interference with pin testing.

Applications

Spray-applied wave and selective soldering for lead-free and tin-lead circuit-board assemblies.

TDS, SDS & Technical Documents

ALPHA-EF-6100P-LFX-TDS-GL-EN-24Jan2020

English (Technical Data Sheet (TDS))

Technical Specifications

General Properties

Solids

3.6 %

Specific Gravity

0.794 ± 0.003 @25°C

Additional Information

Typical Properties

As Supplied

Typical values for the ready-to-use liquid flux.

Property	Typical Value	Units	Method or Condition
Appearance	Clear, colorless to pale yellow liquid		Visual
Solids content	3.8	% by weight	Typical
Specific gravity	0.794 +/- 0.003		25 deg C
Acid number	23.9 +/- 1.2	mg KOH/g	Typical
pH	3.3		5% aqueous solution
Flash point	12	deg C	T.C.C.
Shelf life	360	days	From date of manufacture
Flux classification	ORL0		IPC J-STD-004