ALPHA SACX0807
Harmonization Code : 3215907090 | Ink, whether or not concentrated or solid (excl. printing ink, printer/copier ink cartridges incorporating mechanical or electrical components, and solid ink in engineered shapes for printers/copiers)
Main features
- Low-silver lead-free solder alloy designed to provide soldering and reliability performance similar to higher-silver ALPHA SAC alloys while reducing material cost versus SAC305.
- Low dross rate, low copper erosion rate, and low surface tension support alloy utilization, fast wetting, high wetting force, and excellent hole fill.
- Suitable for lead-free wave and selective soldering across single- and double-sided boards, including assemblies with OSP pad finishes exposed to prior reflow excursions.
Product Description
ALPHA SACX Plus 0807 Lead-Free Solder Alloy is a low-silver alloy formulated with proprietary additives to provide soldering and reliability performance similar to higher-silver ALPHA SAC alloys such as SAC305 and SAC405. Designed for lead-free wave and selective soldering, it combines a 216 °C solidus and 225 °C liquidus with low dross, low copper erosion, and low surface tension for fast wetting and high wetting force. ALPHA's proprietary Vaculoy process removes certain impurities, particularly included oxides, to help control drossing and solder viscosity. SACX Plus 0807 is suitable for single- and double-sided boards and is particularly suited to assemblies with OSP pad finishes exposed to prior reflow excursions.
Key features
- Low-silver lead-free alloy: Designed to provide soldering and reliability performance similar to higher-silver ALPHA SAC alloys while offering lower material cost than SAC305.
- Low dross and copper erosion: Supports higher alloy utilization and reduces copper-erosion risk during high-temperature, extended-exposure processes.
- Fast wetting and hole fill: Low surface tension provides fast wetting with high wetting force for excellent hole fill and low SMD-related defects.
- Wide lead-free process capability: Suitable for wave and selective soldering, with a recommended wave-solder pot temperature of 255 to 270 °C.
Applications / Suitable for
- Lead-free wave soldering
- Lead-free selective soldering
- Single- and double-sided electronic assemblies
- Assemblies with OSP pad finishes exposed to prior reflow excursions
- Solid-wire replenishment and rework requirements
TDS, SDS & Technical Documents
Technical Specifications
Electrical Properties
Additional Information
As-supplied / before-processing properties
Selected material properties of ALPHA SACX Plus 0807 lead-free solder alloy.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Solidus | 216 | °C | Differential Scanning Calorimeter (DSC) |
| Liquidus (peak) | 225 | °C | Cooling curve |
| Density | 7.4 | g/cm³ | Calculated |
| Resistivity | 0.1399 | µΩm | Measured resistance of solid wire at 22 °C |
| Coefficient of thermal expansion | 19.5 x 10-6 / °C | - | 30 to 100 °C at 1 °C/minute |
| Coefficient of thermal expansion | 20.2 x 10-6 / °C | - | 100 to 180 °C at 1 °C/minute |
| Spread factor | >75 | % | JIS Z 3197 |
| Specific heat | 0.23 | J/g/°C | At 100 °C, DSC |
After-processing / final-state properties
Selected mechanical properties of ALPHA SACX Plus 0807 solder alloy under the documented test conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 16.4 | HV | Vickers hardness, as cast |
| Tensile strength | 30.7 | MPa | Strain rate 10-3 per second |
| Elongation | 21.0 | % | Strain rate 10-3 per second |
| Creep strength | >1000 | hours | 400 g/mm² load at 100 °C |
