OPTOLINQ LE-EP567D | Epoxy Resin for Composite Bonding

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

OPTOLINQ LE-EP567D | Epoxy Resin for Bonding

Main features

  • High bonding strength
  • Excellent insulation
  • Good chemical resistance

Product Description

OPTOLINQ LE-EP567D is a two-component, low viscosity epoxy with excellent handling properties, chemical resistance, and high-gloss finish. It is ideal for potting, casting, sealing, encapsulation, and adhesive applications for composite materials, such as carbon fiber repair. 

The hardener of LE-EP567D does not form insoluble, white solids even after being exposed to air. The cured surface remains oil-free while maintaining excellent gloss retention. Additionally, OPTOLINQ LE-EP567D offers excellent electrical insulation properties under high humidity conditions, withstands exposure to a wide range of chemicals and solvents, and complies to RoHS 2011/65/EU Directive.

Applications

  • Carbon fiber bonding and composite repairs
  • Structural adhesive applications for metals, plastics, and composite materials
  • Potting, casting, and encapsulation for electronics
  • General-purpose sealing and bonding where durability and chemical resistance are needed

 

Product Family

OPTOLINQ LE-EP567D

1. Select Package Type
2. Select Package Size
Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Product availability
US Shipping in 12 weeks
CA Shipping in 12 weeks
EU Shipping in 12 weeks

Technical Specifications

General Properties
Mix RatioMix Ratio
1:1
Electrical Properties
Surface ResistivitySurface Resistivity
5e14 Ohms/sq
Volume ResistivityVolume Resistivity
5e15 Ohms⋅cm
Chemical Properties
Water AbsorptionWater Absorption
0.46 %
Thermal Properties
Degradation temperatureDegradation temperature
192 °C
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
48 °C
Thermal ConductivityThermal Conductivity
0.3 W/m.K
Thermal ImpedanceThermal Impedance
1 °C·cm²/W
Weight Loss @ 300°CWeight Loss @ 300°C
18.75 %

Additional Information

LE-EP567D Recommended Curing Conditions

Property Value Unit
Mixing Ratio (A:B) 1:1 by weight
Pot Life (25℃) 15 minute(s)
Through Cure Time (25℃) 5-7 day(s)
Through Cure Time (80℃) 60 minute(s)

Leading Brands Trust in Our Products and Services

  • Jabil
  • Linxens
  • Magna
  • Medtronic
  • NXP
  • Philips
  • Semikron
  • Teledyne
  • Thales
  • Vishay
  • ZF
  • AMS
  • Apple
  • Audi
  • Broadcom
  • Borgwarner
  • Bosch
  • Eaton
  • Henkel
  • Honeywell
  • Hysol
  • Intel
Products that Perform|Knowledge that Serves|Service that Delivers