DUROPTIX OE-6550
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features
- 1:1 Controlled Mixing
- High Optical Transmittance
- High Refractive Index
Product Description
Duroptix™ OE-6550 A/B Kit is a two-part, 1:1 mix ratio silicone encapsulant formulated for LED packaging and encapsulation applications. Based on methylphenyl siloxane chemistry, this material combines high optical transparency, a refractive index of 1.54, and thermal stability for demanding lighting environments. The cured silicone exhibits 100% transparency at 450 nm (1 mm thickness) and is designed to accommodate stresses generated during thermal cycling, helping protect LED chips and bonding wires. Compatible with standard dispensing and molding processes, Duroptix™ OE-6550 A/B Kit supports efficient manufacturing while delivering optical and electrical properties required for LED device performance.
Key features
- 100% transparency at 450 nm: High optical transmittance supports efficient light transmission in LED encapsulation applications.
- High refractive index of 1.54: Provides optical characteristics suitable for LED packaging and light management designs.
- Thermally stable silicone system: Designed to withstand thermal cycling and compatibility requirements associated with modern LED manufacturing processes.
Applications / Suitable for
- LED encapsulation
- LED package protection
- Light-emitting diode manufacturing
- Dispensing applications
- Molding applications
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical pre-processing properties for the two-part silicone encapsulant system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product configuration | Two-part | - | A/B kit |
| Mix ratio | 1:1 | - | Part A : Part B |
| Color | Colorless | - | As supplied |
| Viscosity (Part A) | 23,600 | cP | Part A |
| Viscosity (Part B) | 920 | cP | Part B |
| Mixed viscosity | 3,800 | cP | Mixed material |
| Heat cure time | 60 | minutes | 150°C |
After-processing / final-state properties
Typical cured properties of the silicone encapsulant.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Specific gravity | 1.15 | - | Cured |
| Durometer | 55 | Shore A | Cured |
| Tensile strength | 1.3 | MPa | Typical cured value |
| Elongation | 75 | % | Typical cured value |
| Volume resistivity | 9E+15 | ohm·cm | Electrical property |
| Transparency | 100 | % | 450 nm, 1 mm thick |
| Refractive index | 1.54 | - | Optical property |





















