Loctite STYCAST 3103
Harmonization Code : 3907.30.00.15 | Epoxide resin, halogen-free
Main features
- Low-Viscosity Solvent-Free Epoxy
- Room-Temperature or Heat Cure
- Electrically Insulating Epoxy
Product Description
LOCTITE® STYCAST 3103 BIPAX is a black, two-part, solvent-free epoxy casting compound for potting and encapsulation applications requiring mechanical, thermal, and electrical insulating properties. The low-viscosity system mixes at a 100:10.5 resin-to-hardener ratio by weight and can be cured at room temperature or with heat. Once cured, it provides resistance to thermal shock, impact, chemicals, and environmental exposure across an operating temperature range of -60 to 145°C.
Key features
- Electrical insulation: Formulated for applications requiring electrically insulating encapsulation.
- Low-viscosity processing: Provides a mixed viscosity of 4,000 mPa·s (cP) at 25°C for casting and potting.
- Flexible cure options: Cures in 24 hours at 25°C or 4 hours at 65°C.
- Durable cured performance: Resists thermal shock, impact, chemicals, and environmental exposure.
- Low-outgassing and cytotoxicity testing: Passes NASA outgassing standards and ISO 10993-5 elution cytotoxicity testing.
Applications / Suitable for
- Potting and encapsulation
- Applications requiring mechanical, thermal, and electrical insulating properties
- Use with glass, ceramic, most metals, potting shells, and other plastics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Color
black The color
Component System
two part Describes the number of components that must be supplied, mixed, or activated before application or cure.
Mix Ratio
100 : 10.5 The amount of a constituent divided by the total amount of all other constituents in a mixture
Thermal Properties
Glass Transition Temperature (Tg)
80 °C The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Operating Temperature
-60 to 145 °C Thermal Conductivity
5×10^-1 W/m.K Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Electrical Properties
Volume Resistivity
4×10^16 Ohms⋅cm Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
After-processing / final-state properties
Typical cured properties. Values are not intended for use as specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature | -60 to 145 | °C | Cured material |
| Coefficient of thermal expansion | 3.5 × 10-5 | cm/cm/°C | Typical cured property |
| Glass transition temperature (Tg) | 80 | °C | Ultimate |
| Hardness | 85 | Shore D | Typical cured property |
| Reactive solids content | 100 | % | Typical cured property |
| Thermal conductivity | 5 × 10-1 | W/(m·K) | Typical cured property |
| Heat distortion temperature | 102 | °C | Typical cured property |
| Volume resistivity | 4 × 1016 | ohm·cm | At 25°C |
| Volume resistivity | 4 × 1014 | ohm·cm | At 100°C |
| Dielectric strength | 510 | volts/mil | Typical cured property |
| Dielectric constant / dissipation factor | 4.1 / 0.01 | — | At 25°C and 1 kHz |
| Dielectric constant / dissipation factor | 3.8 / 0.01 | — | At 25°C and 100 kHz |
| Lap shear strength, aluminum to aluminum | 18 (2,600) | N/mm² (psi) | Typical cured performance |
