TGP 8000 | Thermal Gap Pad

Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

TGP8000| Thermal Gap Pad

Main features

  • 0.2 Thermal Impedance
  • 8.0 Thermal Conductivity
  • Low oil bleeding/Outgassing

Product Description

Honeywell's TGP8000 Thermal Gap Pads (TGP) provide high thermal performance with ease of use across a multitude of applications. Its ultra-high compressibility enables low stress and excellent conformity to mating surfaces. They are designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing. They have the lowest Thermal impedance out of the entire thermal gap pad portfolio, only to be matched by TGP8000HV that is a similar material with Higher Breakdown Voltage.

Honeywell's TGP8000 is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. It exhibits low oil bleeding and outgassing along with low hardness. Naturally, the bleeding will depend on the pressure differential. A 0.5mm pad can be compressed to fill sub-0.4 mm gaps.

Products are available in a thickness range from 0.5mm to 5.0mm.

Product Family

SOLSTICE TGP8000

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Product availability
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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Gray
Film ThicknessFilm Thickness
0.5 - 5 mm
Specific GravitySpecific Gravity
3.4
Thermal Properties
Thermal ConductivityThermal Conductivity
8.0 W/m.K
Thermal ImpedanceThermal Impedance
0.2 °C·cm²/W
UL 94 RatingUL 94 Rating
V-0
Electrical Properties
Volume ResistivityVolume Resistivity
6500000000000000 Ohms⋅cm

Additional Information

Thermal Resistance versus Pressure Graph at Different Thickness of TGP8000 ASTM D5470

Compression Deflection Graph at Different Thickness of TGP8000 ASTM D575

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