HGP12PT | High Thermal Conductivity Putty Pad

Main features

0.13 Thermal Impedance
12 Thermal Conductivity
Low oil bleeding & Low volatile

Product Description

Solstice HGP12PT is an ultra-soft, high performance thermal putty pad engineered for pressure-sensitive electronic assemblies. With a thermal conductivity of 12.0 W/m·K, it provides excellent heat dissipation across varying bond line thicknesses while maintaining very low mechanical stress on delicate components.

The special polymer formulation allows Solstice HGP12PT to conform easily to uneven surfaces and fill gaps with multiple tolerances. Its tacky surface improves adhesion and contact wetting, while a fiberglass reinforcement layer enhances mechanical integrity for easier handling and application.

Designed for use in telecommunications, data centers, lighting, and automotive control units, HGP12PT combines performance, reliability, and ease of use for demanding electronic environments.

Applications

Telecommunications and networking modules
GPUs, CPUs, and data-center processors
High-power LED and LCD lighting assemblies
Solid-state drives (SSD) and memory modules
Wireless communication and base-station equipment

TDS, SDS & Technical Documents

HGP12PT_TDS

English (Technical Data Sheet (TDS))

Technical Specifications

General Properties

Color

Red

Film Thickness

0.5 - 2 mm

Specific Gravity

3.3

Thermal Properties

Thermal Conductivity

12.0 W/m.K

Thermal Impedance

0.13 °C·cm²/W

UL 94 Rating

V-0

Electrical Properties

Volume Resistivity

10000000000000 Ohms⋅cm

Additional Information

Frequently Asked Questions About HGP12PT (12 W/m·K Ultra-Soft Thermal Putty Pad)

What are typical applications for HGP12PT?

HGP12PT is commonly used in thermal management of sensitive electronics that require extreme softness and stress-free assembly.

Telecommunications equipment
GPU and data center systems
High-power lighting (LED, LCD, optical)
SSD thermal pads for controllers and NAND
Wireless and RF modules

Why choose HGP12PT over alternatives?

HGP12PT provides 12 W/m·K conductivity in an ultra-soft, tacky putty format reinforced with fiberglass. It fills difficult gaps, minimizes mechanical stress, and maintains low oil bleed and low siloxane levels for contamination-sensitive assemblies.

What is the shelf life of HGP12PT?

HGP12PT has a shelf life of 12 months when stored at 0–35°C.

How do I clean tools after applying HGP12PT?

Tools can be cleaned with electronics-safe solvents such as isopropyl alcohol to remove tacky silicone residues.

What happens after shelf life?

After shelf life, the pad’s softness and tackiness may shift, potentially affecting gap-fill behavior and performance consistency.

How do I cure HGP12PT?

HGP12PT is a non-curing thermal putty pad. It is installed directly without heating or UV exposure.

What thickness should I apply?

HGP12PT is available in 0.5–5.0 mm thickness. Select the thickness that matches your gap requirements and compression tolerance.

How is it applied and removed?

The pad can be placed manually. Its tacky surface keeps it in position during assembly. It can be peeled off and replaced during rework as needed.

What temperatures can it withstand?

HGP12PT operates reliably from -40°C to +125°C.

Any safety or storage tips?

Store at 0–35°C. Avoid dust contamination on the tacky pad surface. Handle using standard guidelines for silicone-based thermal pads.

Learn More About HGP12PT (12 W/m·K Ultra-Soft Putty Pad)

HGP12PT is an ultra-soft thermal putty pad designed to fill complex gaps with minimal force. Its tacky surface promotes good wetting, while the fiberglass reinforcement provides mechanical stability during handling and installation.

Key Features at a Glance

✔ 12.0 W/m·K thermal conductivity
✔ Ultra-soft, highly conformable structure
✔ Tacky surface for excellent wetting
✔ Fiberglass reinforcement
✔ Low volatile and low oil bleed
✔ UL 94 V-0 flame retardancy

Versatile Application Methods

Application Methods

HGP12PT is placed manually onto components. Its tacky surface ensures good adhesion during assembly, and the fiberglass layer maintains pad integrity during installation.

Reliable Across Environments

Low oil bleed, low volatility, and consistent putty-like mechanical behavior ensure reliable long-term operation from -40°C to +125°C.

Compliance You Can Trust ✅

HGP12PT meets the key requirements for high-reliability thermal interface materials.

UL 94 V-0 flame retardant
Low volatile content (ASTM E595)
Low siloxane (D3–D10 <100 ppm)
ASTM D5470 thermal validation
ASTM D257 electrical insulation
Operating temperature -40°C to +125°C

High-Heat, High-Conformability Applications for HGP12PT

Case 1: High-Power Server VRMs and Memory Modules with Component Height Variation

Server motherboards frequently have inconsistent component heights that create uneven gap distances for VRMs, power inductors, and memory modules. Standard pads may not compress enough in low-pressure zones, leaving air pockets.

Case 5: Power Modules and IGBT Assemblies with Warpage or Bowed Substrates

Power semiconductor baseplates, especially copper or DBC surfaces, may warp during manufacturing or thermal cycling, creating uneven contact areas.

Case 3: Filling Large and Irregular Gaps in Automotive Power Control Units (PCUs)

Modern PCUs often have uneven housings and components with large mechanical tolerances. Traditional gap pads cannot fully conform to deep surface irregularities, resulting in poor contact and high thermal resistance.

Case 4: Telecom RF Amplifiers and Baseband Units with Tight Assembly Tolerances

5G and telecom hardware include sensitive and densely packed RF systems where slight misalignments create unpredictable air gaps.

Solstice HGP12PT Solution

The putty pad accommodates complex geometries and pressure variations, ensuring consistent heat transfer from RF chipsets and PA modules. Its low-modulus and compressible nature protects fragile components while preventing hotspot formation during continuous transmission. The material remains stable under high ambient temperatures common in telecom shelters and outdoor cabinets.