LOCTITE TCF1000

LOCTITE TCF 1000 Phase-Change Thermal Interface Material combines a dry phase-change compound with an aluminum substrate for heat-sink and chassis interfaces. The compound softens at 60 deg C and flows under component mounting pressure to conform to surface features and reduce interface air. Two aluminum-backed constructions provide total thicknesses of 0.076 or 0.101 mm, with thermal impedance values specified at 20 and 100 psi. The silicone-free material is reworkable, can be removed without foreign residue, and is available as die-cut pads, sheets, or rolls for converters, power modules, IGBTs, RF components, and other non-isolated heat-generating devices.

Key features

• Pressure-Dependent Thermal Performance: Thermal impedance is specified for AL and ALH constructions at 20 and 100 psi.
• Reworkable Silicone-Free Construction: The dry interface can be removed without foreign residue after disassembly.
• Converted Pad and Roll Formats: Available as die-cut pads, sheets, or rolls for controlled interface placement.

Applications

Applications include DC-DC converters, solid-state relays, power transistors and modules, IGBTs, RF components, and non-isolated heat-generating devices mounted to heat sinks or chassis.