Loctite EA 956 AERO EPOXY ADHESIVE
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features
- 1,000 psi Lap Shear
- Room-Temperature or Accelerated Heat Cure
- Low-Viscosity Adhesive Application
Product Description
LOCTITE® EA 956 AERO Epoxy Paste Adhesive is a two-component, amber epoxy adhesive formulated for structural bonding and repair applications requiring elevated-temperature strength. Its low-viscosity mixed consistency supports application by laminating, injection and coating. The adhesive can be cured at room temperature over 5 to 7 days or processed using an accelerated thermal cure for small mixed quantities. When cured for 1 hour at 200°F/93°C, it retains 1,000 psi (6.9 MPa) tensile lap shear strength at 300°F/149°C under ASTM D1002 testing on chromic-acid-etched 2024-T3 AlClad aluminum.
Key features
- Elevated-temperature bond strength: Retains 1,000 psi (6.9 MPa) tensile lap shear strength at 300°F/149°C after a 1-hour cure at 200°F/93°C.
- Room-temperature or accelerated cure: Supports a 5-to-7-day cure at 77°F/25°C, with accelerated thermal curing available for small masses.
- Low-viscosity two-component system: The mixed adhesive has a viscosity of 162 poise at 77°F, supporting repair processes such as injection, laminating and coating.
Applications / Suitable for
- Repair bonding applications
- Laminating
- Adhesive injection
- Coating applications
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
General Properties
Additional Information
As-supplied / before-processing properties
Component, mixed-material, storage and processing data for the uncured two-component adhesive.
| Property | Part A | Part B | Mixed | Method / condition |
|---|---|---|---|---|
| Product type | Two-component epoxy paste adhesive | Requires mixing before application | ||
| Color | Amber | Amber | Amber | As supplied / mixed |
| Viscosity at 77°F | 350 poise | 20 poise | 162 poise | Brookfield HBT; Part A: spindle 4 at 20 rpm; Part B: spindle 1 at 20 rpm; mixed: spindle 3 at 20 rpm |
| Viscosity at 25°C | 35 Pa·s | 3 Pa·s | — | Brookfield HBT; Part A: spindle 4 at 2.1 rad/s; Part B: spindle 1 at 2.1 rad/s |
| Density | 1.22 g/ml | 0.96 g/ml | 1.15 g/ml | As supplied / mixed |
| Mix ratio by weight | 100 | 58 | 100:58 | Part A:Part B; volume measurement is not recommended for structural applications unless precautions ensure the correct ratio |
| Pot life | >30 minutes | 450 g mass at 77°F/25°C; ASTM D2471 in a water bath | ||
| Recommended component temperature before mixing | Close to room temperature, 77°F/25°C | Separate-component temperature is not otherwise stated as critical | ||
| Maximum mixed quantity | Do not exceed 250 g | Larger quantities may generate dangerous heat buildup and uncontrolled decomposition | ||
| Handling-strength cure | 6 hours at 77°F/25°C | Time to achieve tensile lap shear >500 psi (3.4 MPa) | ||
| Handling-strength cure | 20 minutes at 140°F/60°C | Time to achieve tensile lap shear >500 psi (3.4 MPa) | ||
| Handling-strength cure | 3 minutes at 185°F/85°C | Time to achieve tensile lap shear >500 psi (3.4 MPa) | ||
| Handling-strength cure | 1 minute at 250°F/121°C | Time to achieve tensile lap shear >500 psi (3.4 MPa) | ||
| Room-temperature cure | 5 to 7 days at 77°F/25°C | Stated cure for normal performance | ||
| Accelerated complete cure | 1 hour at 200°F/93°C | For small masses only; accelerated cures are stated up to 200°F/93°C | ||
| Shelf life below 40°F/4°C | 1 year | 1 year | — | Component shelf life |
| Shelf life below 77°F/25°C | 3 months | 1 year | — | Component shelf life |
| Shelf life below 90°F/32°C | 1 month | 1 year | — | Component shelf life |
After-processing / final-state properties
Typical cured adhesive and bonded-joint properties. Values remain specific to the stated cure, specimen, substrate, preparation, test temperature and test method.
| Property | Value | Cure / test condition | Method / specimen |
|---|---|---|---|
| Tensile lap shear strength at -67°F/-55°C | 1,780 psi (12.3 MPa) | Cured 5 days at 77°F/25°C | ASTM D1002; 2024-T3 AlClad aluminum, chromic-acid etched |
| Tensile lap shear strength at -67°F/-55°C | 2,400 psi (16.5 MPa) | Cured 1 hour at 200°F/93°C | ASTM D1002; 2024-T3 AlClad aluminum, chromic-acid etched |
| Tensile lap shear strength at 77°F/25°C | 2,300 psi (15.8 MPa) | Cured 5 days at 77°F/25°C | ASTM D1002; 2024-T3 AlClad aluminum, chromic-acid etched |
| Tensile lap shear strength at 77°F/25°C | 2,250 psi (15.5 MPa) | Cured 1 hour at 180°F/82°C | ASTM D1002; 2024-T3 AlClad aluminum, chromic-acid etched |
| Tensile lap shear strength at 77°F/25°C | 2,500 psi (17.2 MPa) | Cured 1 hour at 200°F/93°C | ASTM D1002; 2024-T3 AlClad aluminum, chromic-acid etched |
| Tensile lap shear strength at 300°F/149°C | 1,000 psi (6.9 MPa) | Cured 1 hour at 200°F/93°C | ASTM D1002; 2024-T3 AlClad aluminum, chromic-acid etched |
| Tensile lap shear strength at 400°F/204°C | 300 psi (2.1 MPa) | Cured 1 hour at 180°F/82°C | ASTM D1002; 2024-T3 AlClad aluminum, chromic-acid etched |
| Tensile lap shear strength at 400°F/204°C | 300 psi (2.1 MPa) | Cured 1 hour at 200°F/93°C | ASTM D1002; 2024-T3 AlClad aluminum, chromic-acid etched |
| Defined service temperature | 300°F (149°C) | Cured 1 hour at 200°F/93°C | Temperature at which the adhesive retains 1,000 psi (6.9 MPa) under ASTM D1002 |
| Tensile strength at 77°F/25°C | 6,900 psi (47.5 MPa) | Cured 2 hours at 200°F/93°C | ASTM D638; 0.125 in/3.18 mm casting |
| Tensile strength at 77°F/25°C | 5,800 psi (40.0 MPa) | Cured 7 days at 77°F/25°C | ASTM D638; 0.125 in/3.18 mm casting |
| Tensile modulus at 77°F/25°C | 360 ksi (2,483 MPa) | Cured 2 hours at 200°F/93°C | ASTM D638; 0.125 in/3.18 mm casting |
| Tensile modulus at 77°F/25°C | 370 ksi (2,552 MPa) | Cured 7 days at 77°F/25°C | ASTM D638; 0.125 in/3.18 mm casting |
| Elongation at break at 77°F/25°C | 2.54% | Cured 2 hours at 200°F/93°C | ASTM D638; 0.125 in/3.18 mm casting |
| Elongation at break at 77°F/25°C | 2.35% | Cured 7 days at 77°F/25°C | ASTM D638; 0.125 in/3.18 mm casting |
| Shore D hardness at 77°F/25°C | 88 | Cured 2 hours at 200°F/93°C | Bulk resin casting |
| Shore D hardness at 77°F/25°C | 85 | Cured 7 days at 77°F/25°C | Bulk resin casting |
| Glass transition temperature, Tg | 253°F (123°C) | Cured 2 hours at 200°F/93°C | Bulk resin casting; Tg method not stated |
| Glass transition temperature, Tg | 156°F (69°C) | Cured 7 days at 77°F/25°C | Bulk resin casting; Tg method not stated |
| Compressive strength at 77°F/25°C | 12 ksi (82.8 MPa) | Cured 7 days at 77°F/25°C | ASTM D695; 0.5 in/12.7 mm casting |
| Compressive modulus at 77°F/25°C | 158 ksi (1,089 MPa) | Cured 7 days at 77°F/25°C | ASTM D695; 0.5 in/12.7 mm casting |
| Dielectric constant | 3.63 | 0.1 kHz | ASTM D149/D150 |
| Dielectric constant | 3.59 | 1.0 kHz | ASTM D149/D150 |
| Dielectric constant | 3.46 | 10.0 kHz | ASTM D149/D150 |
| Dissipation factor | 0.007 | 0.1 kHz | ASTM D149/D150 |
| Dissipation factor | 0.017 | 1.0 kHz | ASTM D149/D150 |
| Dissipation factor | 0.028 | 10.0 kHz | ASTM D149/D150 |
| Volume resistivity | 8.53 × 1014 ohm-cm | Cured bulk material | ASTM D149/D150 |
| Surface resistivity | 2.43 × 1015 ohm | Cured bulk material | ASTM D149/D150 |
| Thermal conductivity | 4.90 × 10−4 cal/s·cm·°C; 0.205 W/(m·K) | Cured bulk material | Test method and cure condition not stated |





















