LOCTITE EA 9432NA

Main features

Thixotropic Non-Sag Placement
30-Minute 300 deg F Cure
3,800 psi Aluminum Shear

Product Description

LOCTITE® EA 9432NA, also known as Hysol® Adhesive 9432NA, is an aluminum-filled, one-component epoxy adhesive supplied as a gray, thixotropic, non-sag paste. The mix-free formulation can be pumped and dispensed onto parts, then thermally cured at 250 to 300°F. It is formulated for tensile shear strength across a broad temperature range and can bond oily or otherwise poorly prepared surfaces, while clean, dry, properly prepared surfaces remain recommended. Tested substrates include aluminum, cold-rolled steel, fiberglass SMC, and fiberglass vinyl ester laminate.

Key features

One-component processing: No mixing is required before application.
Controlled dispensing: Typical viscosity is 150,000 to 300,000 cP with thixotropic, non-sag behavior.
Thermal cure options: Cure for 60 minutes at 250°F or 30 minutes at 300°F.
Temperature-dependent shear performance: Typical tensile shear on etched aluminum is 3,800 psi at 77°F and 3,000 psi at 250°F after a 30-minute cure at 300°F.
Surface-condition tolerance: Typical shear on oily cold-rolled steel is 2,600 psi at 77°F after a 30-minute cure at 300°F.

Suitable for

Bonding aluminum and cold-rolled steel parts.
Bonding fiberglass SMC and fiberglass vinyl ester laminate components.
Heat-cured assembly processes requiring pumpable, non-sag adhesive placement.

TDS, SDS & Technical Documents

Technical Specifications

No specifications available.

Additional Information

One-part epoxy adhesive

LOCTITE® EA 9432NA

This aluminum-filled epoxy adhesive is supplied as a gray, thixotropic non-sag paste for mix-free dispensing and thermal cure. It is formulated for bonding across a range of temperatures and can bond oily or otherwise poorly prepared surfaces, while standard clean, dry surface preparation remains recommended.

One-part epoxy Aluminum-filled Thixotropic non-sag paste Heat-cure adhesive

As-Supplied Properties

Component count

One part

No component mixing is required before dispensing.

Rheology

Thixotropic, non-sag paste

Supports pumping and controlled placement on parts, including vertical surfaces.

Property	Value	Unit	Method / condition
Color	Gray		As supplied
Viscosity	150,000-300,000	cP	Typical as-supplied range; test method not specified
Specific gravity	1.38		At 77°F
Density	11.5	lb/gal	As supplied
Slump	0.3 maximum	in	At 300°F using a 3/8-inch-diameter bead on a vertical surface

Processing

Application and Cure

Use controlled surface preparation, adhesive placement, clamping, and thermal cure to develop the bonded joint. Cure time depends on part geometry, substrate materials, bondline thickness, and oven efficiency.

Conditioning and surface preparation: Allow refrigerated material to return to room temperature. Use clean, dry, properly prepared bonding surfaces.

Dispensing and placement: Apply the adhesive to one or both substrates. The thixotropic paste can be pumped and dispensed without sagging.

Assembly and clamping: Hold the parts in contact until cure is complete. A clamping pressure of 15 psi is recommended to maintain contact during the cure cycle.

Thermal cure: Cure for 60 minutes at 250°F or 30 minutes at 300°F. Cure temperatures below 250°F or above 350°F are not recommended. Confirm the schedule with actual parts and equipment.

Exotherm and cleanup: Avoid curing more than 10 g of uncured adhesive as a concentrated mass; larger quantities in a bondline are acceptable. Remove uncured adhesive before cure using a compatible solvent or citrus cleaner.

Storage and Handling

Ideally store unopened containers at 2 to 8°C (36 to 46°F) in a cool, dry location. Allow refrigerated packages to return to room temperature before use. Keep containers tightly closed, protect them from direct sunlight, heat, sparks, and flame, and do not return unused material to the original container. Do not use in pure oxygen or oxygen-rich systems or as a sealant for chlorine or other strong oxidizing materials. Contact technical service for product-specific shelf-life information.

Cured adhesive

Cured Material Properties

Typical laboratory values for the cured adhesive. Use these data for material evaluation rather than as guaranteed design allowables.

Property	Value	Unit	Method / condition
Tensile strength	7,350	psi	Typical cured-material value; ASTM D 638
Modulus	680,000	psi	Typical cured-material value; ASTM D 638
Elongation	1.2	%	Typical cured-material value; ASTM D 638
Hardness	90	Shore D	Typical cured-material value

Bond Strength Performance

Tensile shear results show how cure, test temperature, substrate, and surface condition influence joint performance. Values are typical laboratory results for the stated configurations.

Etched aluminum across test temperatures

Typical tensile shear was 3,500 psi at -67°F, 3,800 psi at 77°F, 3,000 psi at 250°F, 2,400 psi at 300°F, and 400 psi at both 350°F and 400°F.

ASTM D 1002; etched aluminum; cured 30 minutes at 300°F.

Substrate and surface-condition comparison at 77°F

Typical tensile shear was 3,500 psi on degreased aluminum; 3,000 psi on abraded cold-rolled steel; 2,850 psi on degreased cold-rolled steel; 2,600 psi on oily cold-rolled steel; 400 psi on Owens Corning fiberglass SMC; 380 psi on Budd Company fiberglass SMC; and 1,000 psi on fiberglass vinyl ester laminate.

ASTM D 1002; cured 30 minutes at 300°F; tested at 77°F.

Next steps

Evaluate LOCTITE EA 9432NA for your bonding process

Krayden can help review substrate preparation, dispensing approach, bondline design, clamping, and thermal-cure conditions for LOCTITE EA 9432NA. Contact our technical team to discuss production trials and confirm a cure schedule using your actual parts, materials, and equipment.

Contact Krayden