LINQSOL EMC-7535MF | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQSOL EMC-7535MF | High Tg Mold Compound

Main features

  • Green molding compound
  • Designed for high-power TO packages
  • High Tg, low water absorption, low modulus, and excellent thermal stability

Product Description

LINQSOL EMC-7535MF is a green epoxy molding compound specifically developed for high-voltage and high-power semiconductor devices. It offers low modulus to meet low-stress requirements. With a high glass transition temperature (Tg = 215 °C), minimal moisture absorption, a high comparative tracking index (CTI = 600 V), and a UL 94 V-0 flammability rating highlighting its adherence to stringent safety standards for high-power semiconductor applications,  EMC-7535MF guarantees strong performance and outstanding reliability.

Overall, LINQSOL EMC-7535MF seamlessly integrates advanced material properties, safety compliance, and superior performance, precisely meeting the stringent demands of high-power semiconductor components such as TO packages. LINQSOL EMC-7535MF finds its niche in high-voltage and high-power discrete packages and power modules, including but not limited to IGBT, TO220, TO247, and other surface mount devices.

LINQSOL EMC-7535MF proved its reliability in customers' small SiC discretes—zero voids, zero delamination on Ni-plated Cu leadframes—even after thermal cycles (−40 °C ↔ +125 °C).

 

Key Features:

  • High-temperature stability with high Tg (215 °C) 
  • Excellent electrical stability due to low ion content and mobility
  • Low stress with low CTE (9 ppm) and low modulus (15GPa)
  • Low moisture absorption and low mold shrinkage (0.22%)
  • Halogen-free (does not contain Br, Sb, P)
  • UL 94 V-0 Flammability 

Application: SiC MOSFETsTO-package Devices, IGBT Modules

Product Family

LINQSOL EMC-7535MF

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Black
Filler ContentFiller Content
84 %
Specific GravitySpecific Gravity
1.96
Electrical Properties
Volume ResistivityVolume Resistivity
33000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorptionMoisture absorption
≤ 0.35 %
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
215 °C
Thermal ConductivityThermal Conductivity
0.8 W/m.K
UL 94 RatingUL 94 Rating
V-0
Mechanical Properties
Molded ShrinkageMolded Shrinkage
0.22 %
Curing Conditions
Transfer PressureTransfer Pressure
40-90 kg/cm2
Transfer TimeTransfer Time
10-25 s
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
85 cm
ViscosityViscosity
44000 mPa.s

Additional Information

Processing Instructions

  • Before use, let LINQSOL EMC-7535MF reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination. 
  • Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-7535MF is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life at 5 °C is 183 days.

 

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