LINQSOL EMC-7535 | Black Epoxy Mold Compound

Main features

Green molding compound
Designed for high-power TO packages
High Tg, low water absorption, low modulus, and excellent thermal stability

Product Description

LINQSOL EMC-7535 is a green epoxy molding compound specifically developed for high-voltage and high-power semiconductor devices. It offers low modulus to meet low-stress requirements. With a high glass transition temperature (Tg = 175 °C), minimal moisture absorption, a high comparative tracking index (CTI = 600 V), and a UL 94 V-0 flammability rating, EMC-7535 guarantees strong performance and outstanding reliability.

Overall, LINQSOL EMC-7535 seamlessly integrates advanced material properties, safety compliance, and superior performance, precisely meeting the stringent demands of high-power semiconductor components such as TO packages.

TDS, SDS & Technical Documents

Technical Specifications

General Properties

Color

black

Filler Content

75 %

Specific Gravity

1.96

Electrical Properties

Volume Resistivity

16000000000000000 Ohms⋅cm

Chemical Properties

Moisture absorption

0.25 %

Physical Properties

Spiral Flow @ 175°C

86 cm

Thermal Properties

Glass Transition Temperature (Tg)

175 °C

UL 94 Rating

V-0

Mechanical Properties

Molded Shrinkage

0.1 %

Curing Conditions

Transfer Pressure

40-90 kg/cm2

Transfer Time

10-25 s

Additional Information

Processing Instructions

Before use, let LINQSOL EMC-7535 reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-7535 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life at 5 °C is 183 days.