LINQALLOY SP-SAC105 | Solder paste

LINQALLOY SP-SAC105 is a Pb-free solder paste composed of 98.5% Sn, 1% Ag, and 0.5% Cu. It has been designed for surface mount technology (SMT). SP-SAC105 is being offered in two options: No-Clean and Water-Soluble. No-clean solder paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues. On the other hand, the water-soluble solder paste is crafted with refined tin powder that allows you to clean flux residue left after the reflow process.

LINQALLOY SP-SAC105 is produced using refined Sn powder and minimal oxide content, enabling exceptional printing capabilities. Our SAC105 solder paste offers a compelling combination of properties for reliable and high performance electronics assembly.