LAIRD TFLEX HD90500
Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other
Main features
- 7.5 W/(m K) Thermal Interface
- Compliant Silicone Gap Filler
- Naturally Tacky Construction
Product Description
Tflex™ HD90500 is a 500 um configuration within the Tflex™ HD90000 Series, a high-performance silicone thermal gap filler engineered for applications requiring efficient heat transfer and low mechanical stress on sensitive electronic components. The ceramic-filled silicone construction provides typical thermal conductivity of 7.5 W/m·K while maintaining high compliance for effective contact across uneven mating surfaces. Naturally tacky surfaces support placement during assembly without requiring an additional adhesive coating.
Key features
- 7.5 W/m·K thermal conductivity for demanding electronics cooling applications.
- Highly compliant silicone construction helps minimize stress while conforming to uneven surfaces.
- Naturally tacky surfaces simplify installation without an additional adhesive layer.
Applications / Suitable for
- Automotive electronics and ADAS modules
- High-performance computing and networking equipment
- Industrial power electronics
- Telecommunications infrastructure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied / Before-Processing Properties
Typical as-supplied properties of Tflex™ HD90500. This product is a part number within the Tflex™ HD90000 Series. Family-level properties are shown where applicable because the specific thickness for HD90500 is not identified in the supplied documentation.
| Property | Value | Unit | Method / Condition |
|---|---|---|---|
| Construction | Ceramic-filled silicone gap filler | — | Tflex™ HD90000 Series |
| Color | Grey | — | Visual |
| Nominal Thickness | 500 | um | HD90500 part number; thickness not identified in supplied documentation |
| Density | 3.5 | g/cm³ | Typical |
| Hardness | 500 and 750 μm: 45 1000 μm and up: 32 |
Shore 00 | ASTM D2240 |
| Surface Condition | Naturally tacky on both sides | — | Standard construction |
| Shelf Life | 2 | years | From date of shipment |
After-Processing / Final-State Properties
Typical installed properties of the Tflex™ HD90000 Series applicable to Tflex™ HD90500. Installed performance varies with compression, final bondline thickness, interface pressure, and mating surfaces.
| Property | Value | Unit | Method / Condition |
|---|---|---|---|
| Thermal Conductivity | 7.5 | W/m·K | ASTM D5470 |
| Operating Temperature | -65 to 125 | °C | Continuous operating range |
| Volume Resistivity | 8.73×1013 | ohm·cm | ASTM D257 |
| Dielectric Constant | 8.14 | — | ASTM D150 @ 1 MHz |
| Flammability | UL 94 V-0 | — | UL 94 |
| Outgassing | Low outgassing | — | ASTM E595 |
