LAIRD TFLEX 660

Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other

LAIRD TFLEX 660

Main features

  • 1.50 mm Medium-Gap of Tflex 600 Series
  • 3.0 W/(m K) Thermal Interface
  • Easy Assembly and Placement with Naturally Tacky

Product Description

Tflex™ 660 is the 1.50 mm-thick configuration of the Tflex™ 600 Series, an exceptionally soft and highly compliant silicone thermal gap filler designed to bridge interfaces between heat-generating components and adjacent cooling surfaces. The blue-violet pad uses a boron nitride-filled silicone construction to provide typical thermal conductivity of 3.0 W/m·K. Its naturally tacky surfaces support placement during assembly without requiring an additional adhesive coating, making it suitable for applications requiring a medium-thickness thermal interface.

Key features

  • 1.50 mm nominal thickness: Specific Tflex™ 600 Series configuration for medium-gap thermal interface applications.
  • Highly compliant construction: Soft silicone gap filler conforms to uneven component and heat sink surfaces.
  • 3.0 W/m·K thermal conductivity: Boron nitride-filled silicone supports efficient heat transfer across the thermal interface.
  • Naturally tacky surfaces: Helps retain pad position during assembly without requiring an additional adhesive coating.

Applications / Suitable for

  • Automotive electronics, ADAS, infotainment, and ECU assemblies
  • Networking and telecommunications equipment
  • Industrial control and power electronics
  • Consumer electronics and embedded computing systems
Product Family

LAIRD TFLEX 660

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Blue Violet
Component SystemComponent System
Ceramic Filled Silicone Sheet
Density (g)Density (g)
1.34 g/cm3
Thickness rangeThickness range
1.50 mm
Thermal Properties
Operating TemperatureOperating Temperature
-45 to 200 °C
Thermal ConductivityThermal Conductivity
3.0 W/m.K
UL 94 RatingUL 94 Rating
V0
Electrical Properties
Volume ResistivityVolume Resistivity
2 x 10^13 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical as-supplied properties of Tflex 6150 and its parent Tflex 600 Series. Values are provided for design guidance and are not guaranteed specifications.

Property Value Unit Method / condition
Construction and composition Ceramic-filled silicone sheet Tflex 600 Series construction
Color Blue-violet Visual
Nominal thickness 1.50 mm  Tflex 660 configuration; nominal uncompressed thickness
Density 1.30 g/cc Typical family-level value
Hardness 51 Shore 00 ASTM D2240
Surface condition Naturally tacky on both sides Standard construction; one-side-tacky option is separately designated
Shelf life 2 years From date of shipment
Technical properties

After-processing / final-state properties

Typical family-level properties relevant to Tflex 6150 after placement within an assembled thermal interface. Installed performance varies with compression, final thickness, contact pressure, surfaces, and assembly design.

Property Value Unit Method / condition
Thermal conductivity 3.0 W/m·K ASTM D5470
Operating-temperature range -45 to 200 °C Documented Tflex 600 Series temperature range
Dielectric constant 3.3 Typical family-level value; frequency not stated in the current product listing
Volume resistivity 2.0 × 1013 ohm·cm ASTM D257
Flammability rating V-0 UL 94; confirm listing scope for the specific thickness and construction

 

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