LAIRD TFLEX 3200
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- Low-Pressure Compliant Gap Filling
- Tgard Dielectric Handling Layer
- Reusable Low-Compression-Set Pad
Product Description
Tflex 3200TG Thermal Gap Filler is a 5.00 mm light-green filled silicone elastomer pad with a Tgard carrier for compliant thermal interfaces. The configured 457 x 457 mm sheet combines 1.2 W/(m K) thermal conductivity with Shore 00 hardness of 27 and one-sided surface adhesion. Its low compression set supports repeated pad use, while the carrier provides a cut-through-resistant dielectric handling layer. Applications include computers, telecommunications hardware, displays, memory modules, power conversion equipment, automotive electronics, LED lighting, and handheld devices.
Key features
- 5.00 mm Configured Sheet: The 18 x 18 inch pad is supplied at the product-specific 5.00 mm thickness.
- Tgard Dielectric Carrier: The carrier supports handling and provides a cut-through-resistant dielectric layer.
- Reusable Compliant Interface: Low compression set supports repeated use while maintaining conformal component contact.
Applications / Suitable for
- Computers, displays, and memory modules
- Telecommunications and power conversion hardware
- Automotive electronics, LED lighting, and handheld devices
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
As-supplied construction, dimensions, and handling properties for the 5.00 mm Tflex 3200TG sheet configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Filled silicone elastomer on Tgard carrier | Tflex 300TG series | |
| Color | Light green | Visual | |
| Configured thickness | 5.00 | mm | 0.200 inch part configuration |
| Configured sheet size | 457 x 457 | mm | 18 x 18 inch part configuration |
| Density | 1.80 | g/cc | Configured product page |
| Hardness | 27 | Shore 00 | ASTM D2240 |
| Surface adhesion | One side | Tflex 300TG series | |
| Shelf life | 2 | years from shipment | Configured product page |
After-processing / final-state properties
Typical thermal, electrical, temperature, and outgassing properties for Tflex 300TG; thermal resistance applies at the stated pressure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.2 | W/(m K) | ASTM D5470 |
| Thermal resistance at 10 psi | 1.59 | deg C-in2/W | Modified ASTM D5470 |
| Operating temperature | -40 to 160 | deg C | Typical range |
| Breakdown voltage | Greater than 10,000 | VAC | ASTM D149 |
| Coefficient of thermal expansion | 600 | ppm/deg C | IPC-TM-650 2.4.24 |
| Outgassing TML | 0.56 | % | ASTM E595 |
| Outgassing CVCM | 0.10 | % | ASTM E595 |
| Flammability | UL 94 V-0 | Typical property |
