LAIRD SNL60RXP

Harmonization Code : 3215907090 | Ink, whether or not concentrated or solid (excl. printing ink, printer/copier ink cartridges incorporating mechanical or electrical components, and solid ink in engineered shapes for printers/copiers)

LAIRD SNL60RXP

Main features

  • 100 dB 200 MHz to 10 GHz Shielding
  • 1-Hour Room-Temperature Handling
  • -50 to 125 deg C Service Range

Product Description

Laird SNL60-RXP is a rapid-curing, silver/aluminum-filled silicone elastomer for automated form-in-place EMI shielding and grounding gaskets. It can be dispensed onto metal or plastic substrates used in cast enclosures, plastic housings, and packaged electronic assemblies. Typical cured properties include volume resistivity of 0.003 ohm-cm, shielding effectiveness above 100 dB from 200 MHz to 10 GHz, Shore A 60 hardness, and a service temperature range of -50°C to 125°C. At 22°C and 50% relative humidity, the material can be handled after 1 hour and reaches full cure in 24 hours.

Key features

  • EMI shielding: Typical shielding effectiveness exceeds 100 dB from 200 MHz to 10 GHz when tested to MIL-DTL-83528C, paragraph 4.5.12.
  • Room-temperature cure: Provides a 1-hour handling time and 24-hour full cure at 22°C and 50% relative humidity.
  • Conductive silicone gasket: Combines a silver/aluminum conductive filler with a flexible silicone elastomer for automated form-in-place dispensing.

Applications / Suitable for

  • EMI shielding and grounding gaskets on metal or plastic substrates
  • Cast and plastic electronic enclosures
  • Base stations, radios, mobile phones, PDAs, and PC cards
  • Packaged electronic assemblies
Product Family

LAIRD SNL60RXP

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

Mechanical Properties
ElongationElongation
140 %
Thermal Properties
Operating TemperatureOperating Temperature
-50 - 125 °C
UL 94 RatingUL 94 Rating
V0
General Properties
Density (g)Density (g)
2.1 g/cm3

Additional Information

Technical properties

As-supplied / before-processing properties

Typical material composition, density, and cure conditions for SNL60-RXP before and during gasket formation.

Property Value Unit Method / condition
Elastomer Silicone As supplied
Conductive filler Silver/aluminum As supplied
Uncured density 1.8 g/cm³ LT-FIP-CLE-09
Cure conditions 15 to 40 °C 50% relative humidity
Time before handling 1 hour 22°C and 50% RH; LT-FIP-CLE-14
Full cure 24 hours 22°C and 50% RH; LT-FIP-CLE-14
Technical properties

After-processing / final-state properties

Typical electrical, mechanical, and service properties of fully cured SNL60-RXP.

Property Value Unit Method / condition
Shielding effectiveness >100 dB MIL-DTL-83528C, paragraph 4.5.12; 200 MHz to 10 GHz
Volume resistivity 0.003 ohm-cm Typical cured value
Hardness 60 Shore A ASTM D2240
Tensile strength 850 kPa ASTM D412
Tensile elongation 140 % ASTM D412
Compression set 10 % ASTM D395
Adhesion strength 140 N/cm² Aluminum substrate; LT-FIP-CLE-03
Service temperature range -50 to 125 °C Typical stated range

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