KESTER NP545 Solder Paste
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- 0.50-Area-Ratio Fine-Feature Printing
- Zero-Halogen No-Clean Residue
- Air or Nitrogen Reflow Wetting
Product Description
KESTER® NP545 Solder Paste is a zero-halogen, no-clean solder paste formulated for consistent and repeatable printing and reflow performance. Designed for SnPb assembly processes, it supports paste transfer efficiencies down to 0.50 area ratio and is capable of printing and reflowing 01005 components in air with minimal graping. The paste produces clear residue and is available in Sn63Pb37 and Sn62Pb36Ag2 alloys with Type 4 powder.
Key features
- Fine-feature print capability: Delivers consistent paste transfer performance down to 0.50 area ratio and supports printing and reflow of 01005 components.
- Zero-halogen, no-clean formulation: Contains no intentionally added halogens and produces clear, non-conductive residue that does not require removal.
- Flexible reflow performance: Provides solderability and wetting across a wide range of profiles with similar performance in air and nitrogen.
Applications / Suitable for
- Standard- and fine-pitch surface-mount assembly
- Printing and reflow of 01005 components
- Air- and nitrogen-reflow processes
- SnPb assemblies incorporating complex lead-free components
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
Published physical, printing, and availability data for SnPb and SnPbAg Type 4 formulations.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Available alloys | Sn63Pb37; Sn62Pb36Ag2 | — | Published product availability |
| Powder size | Type 4; 20–38 | µm | Sn63Pb37 and Sn62Pb36Ag2 formulations |
| Viscosity, typical | 1250 | poise | Malcom Viscometer at 10 rpm and 25°C; based on SnPb/SnPbAg Type 4 |
| Initial tackiness, typical | 35 | grams | J-STD-005; IPC-TM-650, Method 2.4.44 |
| Cold slump | Pass | — | J-STD-005; IPC-TM-650, Method 2.4.35 |
| Hot slump | Pass | — | J-STD-005; IPC-TM-650, Method 2.4.35 |
| Stencil life | 8 | hours | 20–25°C (70–77°F) and 35–65% RH |
| Flux classification | ROL0; ROM0 | — | ROL0 under IPC J-STD-004; ROM0 under IPC J-STD-004B |
| Shelf life | 12 | months | From manufacture when properly handled at 0–10°C (32–50°F); Sn63Pb37 and Sn62Pb36Ag2 |
After-processing / final-state properties
Published wetting, residue, corrosion, and electrical reliability results.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Solder ball test | Pass | — | J-STD-005; IPC-TM-650, Method 2.4.43 |
| Wetting | Pass | — | IPC-TM-650, Method 2.4.45 |
| Copper mirror corrosion | No breakthrough “L” | — | J-STD-004B; IPC-TM-650, Method 2.3.32 |
| Corrosion test | No corrosion “L”; minor corrosion “M” | — | J-STD-004, IPC-TM-650 Method 2.6.15B; J-STD-004B, Method 2.6.15C |
| Halogen content | None detected | — | J-STD-004B; IPC-TM-650, Method 2.3.41 |
| Electrochemical migration | Pass | — | J-STD-004B; IPC-TM-650, Method 2.6.14.1; 65°C, 90% RH, 100 V, 25 days |
| Surface insulation resistance | Pass | — | J-STD-004B; IPC-TM-650, Method 2.6.3.7; 40°C, 90% RH, 7 days, 12.5 V |
| Reflowed residue | Clear and non-conductive | — | After reflow; residue removal not required |
