KESTER NF372-TB Soldering Flux

Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)

KESTER NF372-TB Soldering Flux

Main features

  • Provides good solderability at atmospheric temperature
  • Zero-halogen & low solids formulation
  • Safe for rework

Product Description

KESTER NF372-TB is a  zero-halogen, no-clean, low solids liquid flux engineered for superior performance in demanding soldering operations. It's universally compatible with both leaded and lead-free alloys and is classified as ROL0 under the IPC J-STD-004B standard, ensuring minimal and safe residues.

NF372-TB Solder Flux is part of Kester’s high reliability product line and compatible with NP505-HR Solder Paste, RF550 Rework Flux and SELECT-10™ Selective Soldering Flux.

Product Key Features

  • Zero-halogen & low solids
  • Withstands long dwell times and high preheat temperatures
  • Residues are minimal, clear, and non-tacky
  • Fully compatible with a wide array of leaded and lead-free solder alloys

Applications

  • Thick PCBs or applications requiring high thermal input.
Product Family

KESTER NF372-TB

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
SolidsSolids
3.90 %
Specific GravitySpecific Gravity
0.793

Additional Information

Flux Application



Process Parameters

Process Parameters Recommendation
Flux Deposition 600 to 1400 ug/in2 of solids (93 to 217 ug/cm2)
Top Side Board Temperature
(Bottom Preheaters Only)
75 to 120℃
Top Side Board Temperature
(Bottom and Top Preheaters Only)
95 to 140℃
Bottom Side Board Temperature 0 to 32℃ vs top side board temperature
Recommended Preheat Profile Straight tamp to top side board temperature
Conveyor Speed 0.5 to 1/2 m/min (1.6 to 3.9 ft/min)
Solder Contact Time 3 to 7 seconds
Solder Bath Temperature 260 to 270℃ (500 to 518℉) for SnCu or SAC alloy
245 to 260℃ (473 to 500℉) for Sn63Pb37 alloy

 

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