JNC PI-6673-002 | Insulating Polyimide Ink
Harmonization Code : 32159090 | Printing ink, writing or drawing ink, and other inks, whether or not concentrated or solid, specifically for those classified as other within that category
Main features
- Thermal Curable
- Low Temperature Curing
- Low Warpage
Product Description
PI-6373-002 is a low-temperature cured insulating polyimide ink specially designed to meet the demands of high thermal applications, which provide solution for heat resistance and insulation applications.
PI-6673-002 is engineered to be a thermally curable polyimide ink with remarkable insulating properties making it ideal choice for electrical isolation and heat management applications. Its polyimide-based chemistry brings forth the balance between flexibility and resilience. PI-6373-002 features a residual stress of 15 MPa and a coefficient of thermal expansion (CTE) of 146 ppm/K, ensuring compatibility with various materials and minimizing the risk of performance-altering mismatches. Moreover, with a
breakdown voltage of 200 V/um and a dielectric constant of 2.8 @ 1 kHz, ensuring stable electrical isolation and signal integrity for your components.
Industry Applications:
Electronics Manufacturing | Consumer Electronics | Sensors and IoT Devices
Cure condition
- 175⁰C in 60 min
JNC PI-6673-002
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Chemical Properties
Physical Properties
Additional Information
Is Polyimide compatible with SiN substrates?
We have not evaluated the wettability against SiN substrate. Wettability varies depending on the oxidation state and treatment state of the surface, so we cannot give a generic, catch all, answer.
| Properties | PI-6673-002 |
| Solids content (wt. %) | 25 |
| Viscosity (mPa's) @25℃ | 9 |
| Surface tension (mN/m) @23℃ | 28 |
| Printing methods | Inkjet |
| Curing | 175℃ 60min |
| Post-curing | - |
| Volume resistivity (Ω*cm) | 2E+16 |
| Breakdown voltage (V/um) | 200 |
| Dielectric constant (1kHz) @1V | 2.8 |
| Tensile modulus (MPa) | 960 |
| Elongation (%) | 15 |
| Residual stress (MPa) | 15 |
| 5% weight loss temp (℃) | 368 |
| CTE ( | 146 |
| Tg (℃) | 140 |
| Water absorbance (%) @23℃ | 0.5 |
