Hysol MG36F-25A | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Low cost epoxy molding compound
- Good reliability
- For discrete and low count PDIP
Product Description
HYSOL MG 36F-25A is a black, epoxy based molding compound that is designed for the encapsulation of discrete semiconductor devices and low pin count PDIP. It can be applied using both conventional and automold equipments.
HYSOL MG 36F-25A meets UL 94 V0 flammability rating at 3mm thickness. It is a legacy, tried and proven product that has been used extensively from Automotive manufacturers.
HYSOL MG36F-25A
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeksTDS, SDS & Technical Documents
Technical Specifications
General Properties
Electrical Properties
Chemical Properties
Thermal Properties
Curing Conditions
Additional Information
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container labeling.
Powder Storage - Powder or preforms should be stored at 10ºC or below, in closed containers. After removal from cold storage, the material MUST be allowed to come to room temperature, in the sealed container, to avoid moisture contamination. The suggested waiting time for a standard 22 kg pail is 24 hours.
