Hysol GR750 X2

Main features

Low moisture absorption
High Tg: 182°C
For high temperature applications

Product Description

Hysol GR750 X2 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It has good pull tab adhesion on Copper (429 N) and very High Tg (182 °C). The entire GR75XX product line is alterations to the same formulation to fit everybody's needs and X2 leans towards High Tg. It has achieved MSL 3 but we haven't been able to achieve MSL 1, yet. The product is still in active development so some properties might end up higher or lower depending on the state of the final formulation. Its comparative tracking index (CTI) is 600V.

Hysol GR750 X2 is a technologically advanced, non anhydride, green epoxy molding compound with excellent electrical performance, designed for high power devices especially for high temperature application with low moisture absorption requirements. Typical packages can be TO220, ZIP, PentaWatts, Heptawatts and TDA series packages. It delivers outstanding performance and ease of use and it meets UL 94 V-0 flammability at 1/8 inch thickness.

TDS, SDS & Technical Documents

Technical Specifications

General Properties

Color

Black

Filler Content

84 %

Specific Gravity

1.94

Thermal Properties

Glass Transition Temperature (Tg)

182 °C

Thermal Conductivity

0.8 W/m.K

UL 94 Rating

Electrical Properties

Volume Resistivity

15000000000000000 Ohms⋅cm

Chemical Properties

Moisture absorption

0.3 %

Physical Properties

Spiral Flow @ 175°C

114 cm

Curing Conditions

Transfer Pressure

40 - 100 kg/cm2

Transfer Time

6 - 18 s

Additional Information

Comparison of the entire GR7XXX product series

Product Name			MG15F-MOD2	MG15F-0140	GR750 (Std)	GR750 X1 (Std)	GR750X1 (low CTE)	GR720X2 (Std)	GR750 X2FF fine filler	GR720X2 (high CTE)
Epoxy type		-	OCN/BisA/DCPD	OCN/BisA	MFN	MFN/L.W.A.	MFN/L.W.A.	MFN/L.W.A.	MAR	MAR/L.Vis.
Hardener type		-	Anhydride	Anhydride	New	New	New	New	New	New
Filler cut size		µm	106	150	75	75	75	75	45	75
Flammability		UL-94	V-0 at ¼”	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''	V-0 at 1/8''
Spiral Flow		inches	36	20	42	36	26	45	40	41
Gel Time		sec	32	17	26	24	29	30	30	35
Viscosity @ 175°C		PaS	20	28	10	13	43	25	20	15
Tg by TMA		oC	242	195	225	202	197	170	182	170
CTE 1		ppm/°C	16	21	10	8	6	9	9	14
CTE 2		ppm/°C	49	70	40	42	31	35	32	40
DMA Storage Modulus at RT		MPa	18246	14078	20560	23155	29241	21631	23391	20971
DMA Storage Modulus at 260C		MPa	6491	1883	1658	1713	1711	907	1007	961
Tg by DMA Tanδ Peak		0C	270	217	235	207	200	177	182	177
Flexural modulus		Mpa	16312	12449	16880	18042	21469	17470	17549	16900
Flexural strength		Mpa	120	126	138	136	134	152	169	150
Moisture absorption PCT24h		%	0.55	0.65	0.35	0.3	0.2	0.2	0.2	0.2
Cl-/ Na+		ppm	<10	<10	<15	<15	<15	<15	<15	<15
PH			4~6	4~6	5~7	5~7	5~7	5~7	5~7	5~7
Volume resistivity @21C & 500V		Ω.cm	2.4E+16	6.3E+16	3.3E+16	1.7E+16	1.0E+16	1.6E+16	1.8E+16	1.0E+16
Dielectric constant, 21 C & 1MHz			3.6	3.7	3.7	3.7	3.7	3.8	3.8	3.9
Adhesion (tabpull) after MSL3	on Cu	N	344	136	365	406	307	360	407	331
	on Ag	N	235	NA	345	363	269	234	348	415
	on Ni	N	84	111	170	194	130	104	102	110
Comparative Tracking Index		V	600	400	600	600	600	600	600	600
Recommended Molding condition			190°C110s	180°C100s	180°C 90s	180°C 90s	180°C 90s	180°C 90s	180°C 90s	180°C 90s
Recommended PMC condition			190°C 3~6hrs	190°C 3~6hrs	190°C10hrs	190°C10hrs	190°C10hrs	190°C10hrs	190°C10hrs	190°C10hrs