Hysol GR700-P2 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Hysol GR700-P2 | Black Epoxy Mold Compound

Main features

  • MAR Chemistry
  • Very low Tg: 115°C
  • Excellent electrical performance

Product Description

Hysol GR700-P2 is a black, silica filled (75um cut size) semiconductor grade epoxy molding compound. Its epoxy and hardener are based on MAR (Multi aromatic ring) chemistry and the product is part of our low Tg series of products with a Tg of 115°C. It's MSL 1 performance is good and some delamination issues are being dealt with to create an even superior version.

Hysol GR700-P2 can be used for High voltage applications and passes all electrical tests for Silicone Carbide SiC T0247 and T0252 packages with test voltages as high as 1700V. It delivers excellent performance and ease of use. It meets UL 94 V-0 flammability at 1/8 inch thickness. CTI has been measured to be 600V.

 

 

Technical Specifications

General Properties
ColorColor
Black
Density (g)Density (g)
1.99 g/cm3
Electrical Properties
Volume ResistivityVolume Resistivity
53000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorptionMoisture absorption
0.15 %
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
89 cm
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
115 °C
Thermal ConductivityThermal Conductivity
0.9 W/m.K
UL 94 RatingUL 94 Rating
V0

Additional Information

 

GR700 P2 1700 Voltage SiC TO247 Test

  • PKG TO247
  • LF: Cu/Ni

 

DMA and TMA curves for GR700-P2

 

 

 

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