Hysol GR640HV | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR640HV EMC for SOD devicesHysol GR640HV | Black Epoxy Mold CompoundGR640HV Black Epoxy Mold Compound PelletsGR640HV Black Epoxy Mold Compound

Main features

  • EMC for small outline packages including SOD, SOT and SMX
  • JEDEC 1 260°C capable product
  • Excellent electrical performance

Product Description

Hysol GR640HV is a black, transfer molded semiconductor epoxy molding compound. Once transfer molded and post-mold cured, it has excellent mechanical and electrical properties. It offers an excellent balance between outstanding performance, low stressm ease of use (which allows multiple shots between cleaning) and low cost of ownership.

Hysol GR640HV is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on small outline packages including SOT, SOD and SMX package types. Hysol GR640HV meets UL 94 V-0 Flammability at 1/8 inch (3.175mm) thickness.

Hysol GR640HV is designed for the following semiconductor discrete packages:

  • Small outline transistor (SOT) packages
  • Small outline device (SOD) packages
  • SMA, SMB and other SMX packages
 
Product Family

HYSOL GR640HV

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Black
Filler ContentFiller Content
74 %
Specific GravitySpecific Gravity
1.83
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
160 °C
Thermal ConductivityThermal Conductivity
0.85 W/m.K
UL 94 RatingUL 94 Rating
V0
Electrical Properties
Volume ResistivityVolume Resistivity
6000000000000000 Ohms⋅cm
Mechanical Properties
Molded ShrinkageMolded Shrinkage
0.25 %
Chemical Properties
Moisture absorptionMoisture absorption
0.52 %
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
75 cm
Curing Conditions
Transfer PressureTransfer Pressure
40 - 100 kg/cm2
Transfer TimeTransfer Time
10 - 15 s

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