Hysol GR2820 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR2820 Black Epoxy Mold CompoundHysol GR2820 | Black Epoxy Mold Compound

Main features

  • For Conductive Polymer Tantalum Solid Capacitors
  • Ultra-low stress
  • Thin Wall Crack Resistance

Product Description

Hysol GR2820 is a black, ultra low stress, semiconductor-grade epoxy molding compound designed for the encapsulation and protection of thin walled conductive polymer tantalum solid capacitors (POSCAP).  In the world of passive components, POSCAPs are relatively new to the scene. These solid electrolytic capacitors have many advantages, but offer challenges for epoxy mold compound manufacturers. After many years of development, the GR2820 has been developed to have excellent thin wall crack resistance - the greatest challenge of molding these devices. Furthermore, it has been optimized for automolding equipment.

Hysol GR2820 is a silica filled(81%) environmentally "green" halogen free product, meaning it doesn't contain any bromine, antimony or phosphorus flame retardants. Previous MG-series EMC dominated the space for tantalum capacitors but used halogen-containing flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on conductive polymer capacitors. It's fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2820 meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

Product Family

HYSOL GR2820

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Black
Filler ContentFiller Content
83 %
Specific GravitySpecific Gravity
1.90
Electrical Properties
Volume ResistivityVolume Resistivity
16000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorptionMoisture absorption
0.37 %
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
183 °C
UL 94 RatingUL 94 Rating
V0
Curing Conditions
Transfer PressureTransfer Pressure
40 - 100 kg/cm2
Transfer TimeTransfer Time
6 - 18 s
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
66 cm

Additional Information

{tab=Applications}

Short Description of {product_name}

Typical applications and uses of {product_name} include:

  • Condutive Polymer Tantalum Solid Capacitors (POSCAP)
  • Other Tantalum Capacitors

Technical Datasheets for {product_name}

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