Hysol GR2720 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR2720 Black Epoxy Mold CompoundHysol GR2720 | Black Epoxy Mold Compound

Main features

  • For conductive polymer and AO capacitors
  • Excellent thin wall crack resistance
  • Fast cure for automold equipment

Product Description

Hysol GR2720 is a low stress, black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of Conductive Polymer Capacitors and Aluminum Organic (AO) capacitors.  Polymer conductive capacitors and Aluminum Organic capacitors offer very high capacitance in a very small size. Epoxy molding compounds designed for these packages must have very low stress and very good thin wall crack resistance. This is the only way to be able to pass the MSL performance on these package types. GR2720 excels in both fields and has both low stress and excellent thin wall crack resistance.

Hysol GR2720 is a laser markable, environmentally free, halogen free "green" product, meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants.  This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Aluminum Organic (AO) capacitors as well as conductive polymer capacitors. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2720 meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

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HYSOL GR2720

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Black
Filler ContentFiller Content
79 %
Specific GravitySpecific Gravity
1.87
Electrical Properties
Volume ResistivityVolume Resistivity
320000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorptionMoisture absorption
0.30 %
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
96.5 cm
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
160 °C
Thermal ConductivityThermal Conductivity
0.7 W/m.K
UL 94 RatingUL 94 Rating
V0
Mechanical Properties
Molded ShrinkageMolded Shrinkage
0.23 %
Curing Conditions
Transfer PressureTransfer Pressure
40 - 85 kg/cm2
Transfer TimeTransfer Time
6 - 15 s

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