ALPHA HITECH CU11-3127
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- One-Component Capillary Underfill
- 177 deg C Glass Transition
- 20-Minute 140 deg C Cure
Product Description
ALPHA® HiTech™ CU11-3127 Capillary Underfill is a one-component, black capillary underfill for assembled chip packages on printed circuit boards. The material flows beneath packages to reinforce solder joints against drop shock and impact bending and can achieve full coverage at room temperature. Substrate preheating up to 80°C may be used to accelerate flow. The filled formulation combines a typical glass-transition temperature of 177°C with controlled coefficients of thermal expansion and multiple thermal cure schedules for supported assembly processes.
Key features
- Room-temperature capillary flow: The material can achieve full package coverage at room temperature, with preheating up to 80°C to accelerate flow.
- High-Tg, controlled-CTE formulation: Typical Tg is 177°C and the α1 CTE is 29 ppm/°C.
- Flexible thermal cure: Documented minimum cure schedules range from 20 minutes at 140°C to 5 minutes at 165°C.
Applications / Suitable for
- Capillary underfill beneath assembled chip packages
- Printed circuit board assemblies
- Solder-joint reinforcement against drop shock and impact bending
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied values unless otherwise stated. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product form | One-component capillary underfill | N/A | As supplied |
| Color | Black | N/A | As supplied |
| Viscosity | 1,000 to 4,000 | cP | Brookfield RVT, spindle #5, 20 rpm, 25°C |
| Silica filler content | 56 | % | As supplied |
| Average filler size | 0.7 | µm | Typical |
| Maximum filler size | 10 | µm | Typical |
| Specific gravity | 1.55 to 1.65 | N/A | As supplied |
| Cure options | 20 min at 140°C; 15 min at 150°C; 5 min at 165°C | N/A | Minimum documented schedules |
After-processing / final-state properties
Typical final-state values under the stated conditions. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass-transition temperature | 177 ± 5 | °C | TMA |
| CTE below Tg, α1 | 29 ± 10 | ppm/°C | TMA |
| CTE above Tg, α2 | 107 ± 15 | ppm/°C | TMA |
| Hardness | 85 to 95 | Shore D | Typical cured value |
| Storage modulus | 9,120 | MPa | DMA |
| Thermal conductivity | 0.857 | W/m·K | Typical cured value |
| Volume resistivity | 5.4 × 10¹⁶ | ohm·cm | ASTM D257 |
| Dielectric strength | 24 | kV/mm | ASTM D149 |
