FREKOTE 710-NC | Krayden

Main features

Reduced Cleaning Frequency
Thermally Stable Coating
Compatible with Multiple Epoxy Molding Compounds (EMCs)

Product Description

LOCTITE® FREKOTE® 710-NC mold release agent is a semi-permanent coating designed for release of molded semiconductor packages. It provides reliable part release on metal molds while minimizing residue and tool contamination, supporting repeated mold cycles and consistent production quality.

Key features

Low residue: Minimizes build-up on mold surfaces for fewer maintenance cycles.
High thermal stability: Suitable for elevated mold temperatures common in semiconductor package molding.
Compatible with multiple EMCs: Supports epoxy molding compounds and a variety of package materials.

Applications / Suitable for:

Designed for semiconductor transfer, compression, and injection mold release applications
Suitable for high-volume package molding operations
Effective for both single-shot and multi-shot mold cycles

LOCTITE® FREKOTE® 710-NC mold release agent

TDS, SDS & Technical Documents

Technical Specifications

General Properties

Color

Clear Liquid

Specific Gravity

0.755

Thermal Properties

Temperature Resistance

400 ˚C

Additional Information

Semiconductor Mold Maintenance

LOCTITE® FREKOTE® 710-NC mold release agent

Reliable semi-permanent mold release for semiconductor molding; reduces residue and supports multiple mold cycles with high-temperature stability.

Low residue High thermal stability EMC compatible

LOCTITE® FREKOTE® 710-NC mold release agent

Form

Semi-permanent liquid coating

Applied by spray or wipe, ready for use

Temperature Range

-40°C to 200°C

Supports standard semiconductor molding operations

Compatibility

EMCs, metal molds, leadframes

Validated for multiple package types

Processing Summary

Preparation: Ensure mold surfaces are clean and free of previous release agents.

Application: Apply thin, uniform layer by spray or wipe. Allow solvent to flash off.

Cycle Use: Supports multiple mold cycles before reapplication is required.

Storage and Handling: Store in sealed containers at room temperature, away from direct sunlight. Avoid prolonged exposure to heat.

Issue: Sticking on new mold surfaces
Guidance: Pre-condition molds with a thin initial layer and allow proper flash-off
Qualification: Do not exceed recommended cycle counts without performance verification

Performance studies show consistent release across 50 consecutive mold cycles with minimal residue buildup on metal molds (source: Henkel TDS):contentReference[oaicite:0]{index=0}.