LOCTITE ECCOBOND UF 9000AE
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Low die warpage
- Best large die underfill
- 260°C reflow capability for Pb- free, low-k applications
Product Description
LOCTITE® ECCOBOND UF 9000AE is a cutting-edge semiconductor capillary underfill designed specifically to meet the demands of next-generation flip-chip BGA (FCBGA) and high-density fan-out (HD-FO)/2.5D integrated advanced packaging designs. These technologies, critical for AI and high-performance computing (HPC) applications, feature large, high-density I/O die within expansive package dimensions, making warpage prevention and die protection crucial for long-term reliability.
LOCTITE® ECCOBOND UF 9000AE excels in this environment by offering robust protection against die warpage and cracking, which are common concerns due to the fine-pitch interconnects found on large die. This PFAS-free epoxy encapsulant boasts a fast flow rate, ensuring that it can fill gaps efficiently while maintaining the integrity of the delicate interconnects. Its high fracture toughness further enhances durability, ensuring that the die remains protected under various operational stresses.
Once fully cured, LOCTITE® ECCOBOND UF 9000AE forms a rigid, self-filleting protective seal that significantly improves the reliability of solder joints. This protective layer not only extends the electrical, thermal, and moisture resistance of the package but also helps to dissipate stress, thereby enhancing overall performance and longevity. The underfill’s low thermal expansion, fast capillary flow, and extended work-life make it an ideal solution for complex, high-density semiconductor packages, ensuring both comprehensive interconnect protection and high processability. It is the best underfill for large die sizes and flip chips applications with small gaps.
Applications
- Flip-Chip Ball Grid Array (BGA), Cu Pillar Package, and other high-density interconnect designs
Cure schedule
- 15 minute ramp to 100°C; 90 minute hold @ 100°C + 15 minute ramp from 100°C to 165°C; 2 hour hold @ 165°C
ECCOBOND UF9000AE
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General Properties
Thermal Properties
Physical Properties
Additional Information
Key features and benefits
High Reliability
- Low shrinkage and high toughness (K1c = 3.0) offer die and underfill crack resistance
- Low CTE (23 ppm/°C below Tg), highly filled system reduces warpage propensity
- Low/no-voiding bump encapsulation for fine-pitch I/O (100 μm) and low gap heights (> 45 μm)
- Good reliability across all metrics (MSL3a + 2,000 TCT-B cycles, 192 hr. uHAST. 1,000 hr. HTS at 150°C)
Excellent Workability/Processability
- Fast flow for high UPH; 20% faster than previous-generation material*
- Low resin bleed out (RBO) and narrow fillets allow denser chip integration
- Thorough coverage on large die up to 50 mm x 50 mm, and demonstrated effectiveness with large package bodies up to 110 mm x 110 mm
- Excellent workability; long stage life at 100° C
Value Protection
- Proven performance on flip-chip BGA, Cu pillar, and other high-density interconnect designs
- Safeguards large, thin die in complex, 2.5D AI and HPC packages
