LOCTITE ECCOBOND UF 1173
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- One component
- Low CTE
- Automotive grade
Product Description
LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages for Automotive applications.
LOCTITE® ECCOBOND UF 1173 is a one-component underfill that can be jet or needle dispensed, flows fast in and around tight interspaces and cures quickly to form void-free interconnect protection from shock, drop and vibration. Importantly, the novel underfill exhibits high glass transition (Tg) temperature capability of 155°C and a low coefficient of thermal expansion (CTE) to ensure robust protection performance even under stressful conditions.
LOCTITE® ECCOBOND UF 1173 material has been formulated without any reportable REACH SVHCs (current to June 2018) and the product is not CMR classified.
Cure Schedule
- 5 minutes @ 150°C
ECCOBOND UF1173
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Shipping in 25 daysTechnical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
LOCTITE ECCOBOND UF 1173 Data Package
Terms permittivity (Dk) and loss tangent (Df) for UF 1173 - Open ended coaxial probe
