LOCTITE ECCOBOND FP4654
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High purity
- Self levelling
- Low stress
Product Description
LOCTITE® ECCOBOND FP4654 is a low stress, Fill Encapsulant designed for larger cavity-fill or dam-and-fill applications. It is self levelling, jettable and provides an excellent thermal stability.
LOCTITE® ECCOBOND FP4654 has one of the lowest CTE α1 among the series (13ppm) and is our closest "mold compound" simulator with the highest (80%) Silica filler loading.
Recommended Cure Schedule
- 30 minutes @ 125°C plus
- 90 minutes @ 165°C
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Pot LifePot Life
72 hoursSpecific GravitySpecific Gravity
1.85Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
146 °CPhysical Properties
ViscosityViscosity
32,000 mPa.s
