LOCTITE ECCOBOND FP4650
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Excellent chemical resistance
- Low thermal expansion
- High purity
Product Description
LOCTITE ECCOBOND FP4650 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. It is a heat curable fill encapsulant with high purity and a filler content of 83%. The maximum filler size is 120um while the average filler size is 10um. For fine wire pitch applications you can also look into FP4651 with much lower particle filler size.
Recommended Cure Schedule
- 1 hour @ 120°C plus 2 hours @ 160°C
- 3 hours @ 170°C
ECCOBOND FP4650
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Product availability 
Shipping in 78 days
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 78 days Shipping in 12 weeks Shipping in 12 weeksTDS, SDS & Technical Documents
Technical Specifications
General Properties
Pot LifePot Life
192 hoursSpecific GravitySpecific Gravity
1.91Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
140 °CPhysical Properties
ViscosityViscosity
325,000 mPa.s
