LOCTITE ECCOBOND FP4451TD

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Loctite Eccobond FP4451TD

Main features

  • Encapsulant - DAM
  • High purity
  • Exceptional thermal stability

Product Description

LOCTITE® ECCOBOND FP4451TD damming material is designed as a flow control barrier around areas of bare chip encapsulation. It is designed for applications requiring a taller, narrow dam while also being ionically cleaner.

LOCTITE® ECCOBOND FP4451TD is the best DAM option available and it replaces the FP4451. "TD" stands for Tall Dam and implies that it has much better thixotropic properties. Due to the viscosity variation you can adjust the needle diameter in order to use the same DAM tool settings as with FP4451.

Recommended Cure Schedule

  • 30 minutes @ 125°C plus
  • 90 minutes @ 165°C
Product Family

ECCOBOND FP4451TD

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Pot LifePot Life
96 hours
Specific GravitySpecific Gravity
1.79
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
150 °C
Other Properties
MSL LevelMSL Level
MSL 2
Physical Properties
ViscosityViscosity
300,000 mPa.s

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