LOCTITE ECCOBOND E 1216M
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Snap Cure
- Non anhydride curing chemistry
- Excellent adhesion and strength
Product Description
LOCTITE ECCOBOND E 1216M is an innovative epoxy capillary flow underfill, designed for high-volume assembly operations requiring a very fast flowing underfill that fully cures in a single reflow cycle, but is stable enough to be easily shipped and used in large-volume cartridges (up to 20 oz). That's because this is a board-level underfill for underfilling larger components so it is typically dispensed in relatively larger volumes.
LOCTITE ECCOBOND E 1216M passes NASA outgassing standards and is specifically formulated to eliminate anhydride-type curing agents for those users who prefer to work with anhydride-free products.
Cure Schedule
- Snap or Inline Cure - 3 minutes @ 165°C
- Fast Cure - 4 minutes @ 150°C
- Low-Temperature Cure - 10 minutes @ 130°C
ECCOBOND E1216M
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