ECCOBOND 3593
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High-Elongation Cured Material
- High-Adhesion Cured Material
Product Description
LOCTITE ECCOBOND 3593 is a one-component, heat-cure black epoxy underfill formulated for capillary flow beneath chip-size packages. The material is supplied for syringe dispensing and requires no mixing. Its rheology is designed for penetration into gaps as small as 25 µm, with recommended cure schedules of 3 minutes at 165 °C or 5 minutes at 150 °C. Typical uncured viscosity is 3,500–6,500 mPa·s at 25 °C and a shear rate of 5 s⁻¹. After cure, the epoxy provides a glass-transition temperature of 110 °C and typical epoxy-glass lap shear strength of at least 8 N/mm² under the stated test conditions. It is intended for electronics underfill processes where fast capillary flow and short heat-cure cycles are important.
Key features
- Fine-gap capillary flow: Designed to penetrate gaps as small as 25 µm, with a typical 25.4 mm flow time of 70 seconds or less at 100 °C.
- Short heat-cure cycle: Recommended cure schedules are 3 minutes at 165 °C or 5 minutes at 150 °C.
- One-part dispensing: Supplied as a syringe-dispensable liquid epoxy that requires no component mixing.
Applications / Suitable for
- Capillary-flow underfill for chip-size packages
- Electronic component assemblies with gaps as small as 25 µm
- High-throughput syringe-dispensed underfill processes using heat cure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Mechanical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical reference properties for the uncured, as-supplied material. Values should not be treated as guaranteed product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Black liquid | — | Uncured material |
| Component count | One | — | No mixing required |
| Specific gravity | 1.18 | — | At 25 °C |
| Viscosity | 3,500–6,500 | mPa·s | Cone and plate, 25 °C, shear rate 5 s⁻¹ |
| Viscosity | 4,500–6,000 | mPa·s | Cone and plate, 25 °C, shear rate 20 s⁻¹ |
| Capillary flow time | ≤70 | s | 25.4 mm flow at 100 °C, glass-to-glass, 25 µm gap |
| Pot life | 7 | days | At 22 °C |
| Optimal storage temperature | 2–8 | °C | Unopened container in a dry location |
After-processing / final-state properties
Typical cured-material properties after 1 hour at 150 °C unless another cure condition is stated. Values are laboratory reference data and are not universal design allowables.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass-transition temperature | 110 | °C | ASTM D3418 |
| Coefficient of thermal expansion, below Tg | 50 × 10⁻⁶ | K⁻¹ | ASTM E831, pre-Tg alpha 1 |
| Coefficient of thermal expansion, above Tg | 160 × 10⁻⁶ | K⁻¹ | ASTM E831, post-Tg alpha 2 |
| Thermal conductivity | 0.21 | W/(m·K) | ASTM F433 |
| Shore hardness | 88 | Shore D | ISO 868 |
| Tensile strength | 41 | N/mm² | ISO 527 |
| Dielectric breakdown strength | 29 | kV/mm | IEC 60243-1 |
| Lap shear strength | ≥8 | N/mm² | ISO 4587; epoxy-glass; cured 10 minutes at 165 °C and tested at 22 °C |
