DOWSIL TC-5121C
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 2.8 W/(m K) Thermal Interface
- 0.09 deg C cm^2/W Thermal Resistance
- One-Part, Non-Curing and Flowable Formulation
Product Description
DOWSIL™ TC-5121 C Thermally Conductive Compound is a one-part, flowable, non-curing silicone thermal compound designed to transfer heat between electrical devices or PCB system assemblies and a heat sink or chassis. Its filled polydimethylsiloxane formulation provides typical thermal conductivity of 2.8 W/m·K and thermal resistance of 0.09°C·cm²/W at 40 psi. The compound can form thin bondlines and may be applied by dispensing, screen printing, or stencil printing. :contentReference[oaicite:0]{index=0}
Key features
- Effective thermal transfer: Provides typical thermal conductivity of 2.8 W/m·K and low thermal resistance at a defined pressure.
- Non-curing formulation: Requires no curing oven and remains a grease-like thermal-interface compound after installation.
- Thin-bondline capability: Flowable consistency supports screen printing, stencil printing, and dispensing for controlled interface application.
Applications / Suitable for
- Thermal interfaces in mid- to high-end PCB system assemblies
- Heat transfer from electrical devices to heat sinks or chassis
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied properties of DOWSIL TC-5121 C Thermally Conductive Compound. Values are not intended for specification purposes. :contentReference[oaicite:1]{index=1}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Number of components | 1 | part | As supplied |
| Composition | Filled polydimethylsiloxane | — | Product composition |
| Color | Greenish yellow | — | As supplied |
| Viscosity | 79.0 (79,000) | Pa·s (cP) | CTM 0050; temperature and shear conditions not stated |
| Thixotropy | 1.69 | — | CTM 0905 |
| Specific gravity | 4.2 | — | Uncured; CTM 0540 |
| Non-volatile content | 99.93 | % | Test method and conditions not stated |
After-processing / final-state properties
Typical thermal and electrical properties of the non-curing compound. Values are not intended for specification purposes. :contentReference[oaicite:2]{index=2}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 2.8 | W/m·K | CTM 1388; temperature and specimen conditions not stated |
| Thermal resistance | 0.09 | °C·cm²/W | At 40 psi; method and bondline thickness not stated |
| Dielectric strength | 1.89 (47.3) | kV/mm (V/mil) | CTM 0114; specimen thickness and conditioning not stated |
| Volume resistivity | 1.3 × 1013 | ohm·cm | CTM 1400 |
| Dielectric constant | 14.0 | — | At 1 kHz; CTM 1139 |
| Dissipation factor | 0.073 | — | At 1 kHz; CTM 1139 |
