DOWSIL TC-4515
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 1.8 W/(m K) Thermal Conductivity
- 60-Minute Working Window
- 50 Shore 00 Hardness with Vertical-Hold Rheology
Product Description
DOWSIL™ TC-4515 Gap Filler A&B is a two-part, blue, addition-cure silicone gap filler designed to transfer heat from printed circuit boards and electronic devices to heat sinks or aluminium housings. Parts A and B mix at a simple 1:1 ratio by weight or volume. The mixed material has a typical 240 Pa·s viscosity, thixotropic index of 5.0, and 60-minute working time at 25°C. Supported cure schedules are 150 minutes at 25°C or 30 minutes at 80°C. Typical cured properties include greater than 1.8 W/m·K thermal conductivity, 50 Shore 00 hardness, 0.3 MPa shear modulus, 16 kV/mm dielectric strength, and a documented 40 µm minimum bondline thickness at 0.1 MPa without glass beads.
Key features
- Two-part, 1:1 thermally conductive silicone gap filler
- Room-temperature or heat-accelerated addition cure
- Typical thermal conductivity greater than 1.8 W/m·K
- Soft 50 Shore 00 cured hardness for gap conformity
- Thixotropic mixed rheology designed to hold vertical position before and after cure
- Automated meter/mix dispensing compatibility
- UL 94 V-0 and CTI ≥ 600 positioning, subject to the current recognised formulation and construction
Applications
- Engine-control and transmission-control modules
- Electronic modules using an aluminium housing as the heat sink
- PCB-to-housing thermal gap filling
- Power-electronics assemblies requiring automated dispensing and low cured stress
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
DOWSIL™ TC-4515 Gap Filler A&B
A blue, two-part silicone gap filler designed to transfer heat from printed circuit boards and electronic devices to heat sinks or aluminium housings. The 1:1 system combines thixotropic vertical hold, automated meter/mix dispensing, soft cured properties, and room-temperature or accelerated cure for automotive and power-electronics module assembly.
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White Part A, blue Part B, and blue mixed material
Mix Parts A and B at 1:1 by weight or volume. Thorough mixing is required; light-coloured streaks or marbling indicate incomplete mixing.
| Property | Part A | Part B | Mixed material |
|---|---|---|---|
| Colour | White | Blue | Blue |
| Viscosity at 10 s-1 | 215 Pa·s | 230 Pa·s | 240 Pa·s |
| Specific gravity, uncured | 2.7 | 2.7 | Not separately published |
| Mix ratio | 1:1 by weight or volume | ||
| Mixed thixotropic index | 5.0 | ||
| Working time at 25°C | 60 minutes, defined as time for viscosity to double | ||
Premix components, meter 1:1, mix uniformly, dispense and cure
- Inspect both components and remix each container if filler settlement is observed.
- Meter at 1:1 by weight or volume and use an appropriate static mixer.
- Reject or continue mixing if light streaks or marbling remain.
- Automated airless dispensing can reduce or avoid vacuum de-airing.
- When void reduction is required, use only an approved vacuum schedule; the legacy TDS wording around residual pressure is ambiguous and should not be converted into an equipment set point without confirmation.
- Cure for 150 minutes at 25°C or 30 minutes at 80°C.
- No post-cure is required after completion of the selected cure schedule.
- Addition cure proceeds evenly through deep or confined sections and produces no cure by-products.
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Storage and industrial handling
The published shelf life is nine months at 25°C. Follow the Use By date and all special instructions on the product labels. Keep containers tightly closed, minimise headspace, prevent moisture contamination, and purge partially filled containers with dry air or nitrogen where approved. Read the current regional SDS documents and labels before handling. The product is not tested or represented as suitable for medical or pharmaceutical uses.
Soft thermal interface with electrical insulation
The values below are typical bulk-material or controlled-test results, not specifications. Installed thermal resistance depends on bondline thickness, compression, interface area, contact quality, voids, flatness and cure.
| Property | Typical value | Context |
|---|---|---|
| Thermal conductivity | >1.8 W/m·K | ASTM D5470 / CTM 0069. |
| Hardness | 50 Shore 00 | Soft cured gap filler. |
| Shear modulus | 0.3 MPa | DMA in shear mode. |
| Minimum BLT at 0.1 MPa | 40 µm | Without glass beads; controlled test result. |
| Specific heat capacity | 1.0 J/g·°C at 40°C; 1.2 J/g·°C at 150°C | ASTM E1269-11. |
| Coefficient of thermal expansion | 160 ppm/K from -50°C to 150°C | ASTM E831. |
| Dielectric strength | 16 kV/mm | Breakdown property, not a working-voltage rating. |
| Volume resistivity | 8.13 × 1014 ohm-cm | Bulk electrical property. |
| Dielectric constant / dissipation factor | 4.3 / 0.004 at 1 kHz | Frequency-specific values. |
Bridge irregular gaps between electronics and heat-sink structures
TC-4515 is directly positioned for engine-control units, transmission-control units and other modules where heat must move from a PCB or device into an aluminium housing or heat sink. Final qualification should establish the required dispensed volume, gap range, bondline thickness, compression pressure, vertical hold, void level, wet-out, cure, thermal resistance, electrical spacing, temperature cycling, vibration and service life.
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Validate DOWSIL™ TC-4515 for your thermal gap and assembly process
Krayden can help review gap range, dispense volume, 1:1 metering, static mixing, de-airing, vertical hold, bondline thickness, pressure, cure profile, installed thermal resistance, temperature cycling, vibration and assembly qualification.
