DOWSIL SE 4450
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 1.9 W/(m K) Thermal Bonding
- Self-Leveling Flowable Placement
- 6.7 MPa Aluminum Lap Shear
Product Description
DOWSIL™ SE 4450 Thermally Conductive Adhesive is a one-part, gray, heat-curable silicone adhesive formulated for bonding, sealing, and heat dissipation in electronics assemblies. It provides typical thermal conductivity of 1.9 W/m·K and combines self-leveling processing characteristics with high cured tensile strength. The material is suitable for electronic modules, semiconductor packaging, and printed circuit board assembly applications requiring both adhesive bonding and thermal transfer.
Key features
- Thermally conductive: Provides typical thermal conductivity of 1.9 W/m·K for transferring heat through bonded electronic assemblies.
- One-part heat cure: Requires no mixing of separate components and supports heat-accelerated curing.
- Strong adhesive performance: Provides typical tensile strength of 6.7 MPa and aluminum lap-shear adhesion of approximately 3.5 MPa.
Applications / Suitable for
- Electronic modules
- Semiconductor and chip packaging
- Printed circuit board assembly
- Heat dissipation, sealing, bonding, and thermal-interface applications
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied and processing properties of DOWSIL SE 4450 Thermally Conductive Adhesive. Typical values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Number of components | 1 | part | As supplied |
| Color | Gray | — | As supplied |
| Specific gravity | 2.7 | — | Typical value; test conditions not stated |
| Cure type | Heat accelerated | — | Heat-cure adhesive |
| Heat-cure schedules | 30 minutes at 125°C 15 minutes at 150°C |
— | Reported cure options; actual part temperature and assembly conditions should be validated |
After-processing / final-state properties
Typical cured properties of DOWSIL SE 4450 Thermally Conductive Adhesive. Typical values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.9 | W/m·K | Typical cured value; test method, temperature and specimen geometry not stated |
| Hardness | 95 | Shore A | Typical cured value; test method and cure condition not stated |
| Tensile strength | 6.7 | MPa | Typical cured value; test method and specimen preparation not stated |
| Elongation at break | 46 | % | Typical cured value; test method and cure condition not stated |
| Unprimed lap-shear adhesion | 3.45 | MPa | Aluminum lap-shear joint; detailed method, surface preparation, bondline and cure condition not stated |
