DOWSIL SE 1700
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Two-Part Bonding System
- Extended Working Time
- Heat-Accelerated Bonding Cure
Product Description
DOWSIL™ SE 1700 Adhesive is a two-part, translucent or white, non-flowing polydimethylsiloxane adhesive. It is designed with a 10:1 mix ratio and utilizes a heat cure system that allows for rapid, versatile processing controlled by temperature. Featuring a long working time after mixing, it significantly reduces the need for equipment purging and clean-up while delivering high tensile strength.
Product Key Features
- Two-Part System - supplied in two parts that use a simple 10:1 mix ratio by weight, which simplifies the proportioning process.
- Extended Working Time - offers a long working time (pot life) of 8 hours at 25°C, giving users greater manufacturing flexibility and reducing material waste.
- Heat-Accelerated Cure - the cure rate is rapidly accelerated with heat, achieving full cure in 30 minutes at 150°C.
- Robust Mechanical Profile - cures to deliver a high tensile strength of 6.8 MPa (985 psi), a Shore A hardness of 48, and 355% elongation.
- Excellent Electrical Properties - provides reliable insulation with a dielectric strength of 22 kV/mm and a volume resistivity of 5.0E+14 ohm·cm.
Applications
This adhesive is formulated to enhance the reliability and service life of PCB assemblies, offering unprimed adhesion to reactive metals, ceramics, glass, and selected plastics].
- Component Sealing: Ideal for sealing ceramic condensers and various PCB components.
- Device Assembly: Functions effectively as a bonding agent for PC keypads.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
ColorColor
transparent or whiteComponent SystemComponent System
2Mix RatioMix Ratio
10:1Specific GravitySpecific Gravity
1.13Work life @25°CWork life @25°C
8 hoursPhysical Properties
ViscosityViscosity
542,000 mPa.sMechanical Properties
ElongationElongation
355 %Electrical Properties
Dielectric StrengthDielectric Strength
22 kV/mmAdditional Information
Two-Part Non-Flowing High Tensile Strength Silicone
DOWSIL™ SE 1700 Adhesive
DOWSIL™ SE 1700 Adhesive is a premium two-part, translucent or white, non-flowing addition-cure silicone adhesive system engineered for high-performance structural sealing and electrical insulation. Formulated as a high tensile strength polydimethylsiloxane compound, it exhibits a user-friendly 10:1 mixing configuration by weight that eliminates the need for lot matching. This product cross-links smoothly under heat activation without releasing volatile cure by-products, enabling uniform depth cross-linking in fully confined boundaries. Offering a long working time post-mixing, it drastically limits manufacturing waste and helps lower total operations overhead across critical PCB electronics assemblies.
10:1 mix ratio by weight 8-hour extended pot life 985 psi high tensile strength Addition-cure system
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Typical engineering data parameters only. Cure schedules are rapidly accelerated by choosing elevated thermal processing profiles.
DOWSIL™ SE 1700 Adhesive
Key Features
- Two-part addition-cure structural silicone releases zero by-products, enabling deep-section and confined curing.
- Thixotropic non-flowing paste rheology provides excellent bead control on perpendicular or overhead paths.
- Delivers high continuous tensile strength (985 psi) combined with moderate elastomeric flexibility (355% elongation).
- Long working pot life (8 hours at 25°C) reduces material scrap and limits manufacturing equipment purging steps.
- Excellent dielectric properties with a volume resistivity of 5.0E+14 ohm-cm to enhance electronics reliability.
- Establishes reliable unprimed primerless adhesion over many reactive metals, ceramics, and structural glass.
Processing Summary
Proportioning Process: Supplied as a convenient 10:1 mix ratio by weight to simplify factory tracking. Part A must be thoroughly mixed to distribute fillers uniformly before combining with Part B.
Mixing Verification: Ensure a uniform appearance throughout blending. The presence of light-colored streaks or marbling tracks indicates inadequate mixing and will lead to an incomplete cure.
Cure Parameters: Heat cure is completed in 30 minutes at a bondline temperature of 150°C. Increasing the processing temperature and/or cure time will further improve ultimate structural adhesion.
Void Reduction Bake: For thick layers or if section voiding is observed, incorporating an inline 30-minute pre-cure thermal bake at 70°C (158°F) can successfully optimize and reduce bubble entrapment.
Handling and Application Guidance
Process Notes
Storage and Material Handling
- Delivers a stable 18-month usable shelf life from production date when stored unopened at 25°C (77°F).
- Store components strictly inside original protective packaging elements to prevent contamination.
- Track plant inventories carefully against the official "Use Before" date fields marked on the labels.
Surface Preparation
- Thoroughly clean and degrease all target mating faces using Dow OS fluids, naphtha, mineral spirits, or MEK.
- Do not employ acetone or isopropyl alcohol (IPA) alone, as they exhibit poor performance removing heavy oils.
- Introduce fine localized mechanical surface abrasion to expand active clean contact bonding surface area.
- A final surface wipe with acetone or IPA following mechanical texturing can prove highly useful.
Cure Inhibition Avoidance
- Addition-cure platinum catalysts are susceptible to chemical inhibition when in contact with active substances.
- Prevent line contact with organotin/organometallic compounds, tin-catalyzed silicone rubbers, and sulfur.
- Isolate module joints from polysulfides, polysulfones, unsaturated hydrocarbon plasticizers, and solder flux residues.
- The presence of liquid or uncured material at the contact boundary interface signifies active cure inhibition.
Adhesion Upgrades & De-Airing
- Unprimed adhesion is excellent on reactive boundaries, but non-reactive links like Teflon, PE, or PP require aid.
- Incorporate chemical etching or plasma treatments to establish a reactive bonding face on difficult materials.
- Apply specialized Dow chemical primers to increase the chemical bond activity across challenging matrices.
- In applications sensitive to air entrapment, incorporate a vacuum de-air schedule of 28 to 30 inches Hg.
Typical Properties
Engineering Data for DOWSIL™ SE 1700
Physical & Cured Mechanical Performance Properties
| Physical Property Parameter | Typical Engineering Value | Test Condition / Standard Basis |
|---|---|---|
| Appearance | Translucent or white non-flowing paste | - |
| Mixed Viscosity | 542,000 cP | - |
| Working Time (Pot Life) | 8 hours | Measured at 25°C |
| Specific Gravity (Cured) | 1.13 | - |
| Durometer Hardness | 48 Shore A | - |
| Tensile Strength | 985 psi (6.8 MPa / 69 kg/cm²) | - |
| Elongation at Break | 355 % | - |
| Unprimed Adhesion (Lap Shear) | 390 psi (2.7 MPa / 268 N/cm²) | - |
Electrical Insulation Performance (JIS K 6249)
| Electrical Parameter | Typical Engineering Value | Test Condition / Specification Notes |
|---|---|---|
| Dielectric Strength | 550 Volts/mil (22 kV/mm) | - |
| Volume Resistivity | 5.0E+14 ohm cm | - |
| Dielectric Constant (Permittivity) | 3.0 | Measured at 1 MHz |
| Dissipation Factor | 0.001 | Measured at 1 MHz |
Operational Temperature Boundaries: Cured silicone elastomers retain baseline physical and insulating parameters over an extended long-term continuous range of -45°C to 200°C (-49°F to 392°F). Under thermal cycling configurations, low-end extremes down to -55°C (-67°F) may be achieved but performance must be verified across individual component part sensitive constraints.
Applications
Where DOWSIL™ SE 1700 Fits
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PCB Component Sealing & Fixing
Perfect for anchoring and encapsulating sensitive electronic elements across printed circuit board assemblies requiring long-term physical field reliability.
- Maintains insulation properties under broad conditions.
- Bonds components firmly to limit vibrational structural stress.
- Protects assemblies to extend overall module service life.
Sealing Ceramic Condensers
Delivers fluid-tight environmental encapsulation for industrial ceramic condenser assemblies, protecting joints from linear shifting.
- Addition cure progresses without structural shrinkage.
- Unprimed dính bám locks cleanly to ceramic surfaces.
- High dielectric constants maintain stable operating envelopes.
PC Keypad Bonding Agent
Serves as a high-strength structural bonding media for computer keypad elements, ensuring long tactile operation lifetimes.
- Non-flowing thixotropic paste resists running during cure.
- Withstands severe mechanical cycling via high tensile thresholds.
- Favorable processing timelines provide extensive plant assembly flexibility.
Package & Support
Standard Packaging & Technical Help
Standard Container Sizes
- Supplied in nominal 0.45 kg, 3.6 kg, 18 kg, and 200 kg (1, 8, 40, and 440 lb) net weight packages.
- Configured as component pairs that do not require explicit plant lot matching.
- Specialized bladder packs or alternative tube lines may be available for select volumes.
Technical Help Capabilities
- Calibrating automated fluid equipment to maintain continuous 10:1 proportioning accuracy.
- Screening composite multi-material sub-assemblies to eliminate platinum catalyst cure inhibition.
- Advising on vacuum degassing parameters (28 to 30 inches Hg) to negate air entrapment.
- Coordinating small-scale laboratory substrate evaluations to confirm 100% cohesive failure targets.
Technical Guidance
Tips and Troubleshooting
| Issue | Recommended Action |
|---|---|
| Light-colored streaks, marbling trends, or spotty incomplete curing visible across the bead |
|
| Adhesive material remains liquid or tacky at the interface boundary following thermal bake |
|
| Adhesion tracking breakdown or low lap shear force values over specified assembly parts |
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Next Steps
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